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中国惠普有限公司 打印成像与消费市场集团

(全职,发布于2007-01-31) 相关搜索
  • 工作地点:上海
  • 职位:103881 R&D Electrical Hardware Engineer(re)
  • 信息来源:中华英才网
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103881 R&D Electrical Hardware Engineer(re)

中国惠普有限公司 打印成像与消费市场集团



  • 工作性质:全职
  • 工作地点: 上海 
  • 发布日期:2007-01-19
  • 截止日期:2008-01-04
  • 招聘人数:若干
  • 薪水:面议
  • 工作经验:不限
  • 学历:本科以上
  • 简历语言要求:中文
  • 语言能力:不限

职位描述:
    Description

    Background:

    The HP Inkjet Commercial Division has the charter for the development of leading-edge large format inkjet printers for a broad range of markets and needs worldwide, being the first world wide supplier of Large Format Printers. The division is located in Barcelone, Spain. This division is starting a new Product development team in Shanghai. This is an exciting opportunity for experienced professionals interested in developing a career in an international environment in the frame of a very dynamic and growing business.



    Responsibilities:

    Participate as a member of an R&D design team responsible for the concept generation, investigation, circuit design, prototyping, testing, PCA design, qualification and release to production of electronic systems, working with internal and external design partners in an international environment:

    Develop engineering specifications and component requirements; develop solutions to achieve and exceed customer expectations.
    Develop project schedules and drive projects to successful completion. Manage risks associated with the delivery of your project and maintain suitable backup options.
    Designing, prototyping and implementing analog circuit designs, digital circuit designs and system electronics designs.
    Work with layout designers to generate cost effective and reliable PCB layouts
    Test and verify your solutions to meet all functionality, reliability, serviceability, customer, and regulatory requirements.
    Assist the organization in maintaining system quality throughout the product lifecycle.
    Solving many technically challenging issues.
    We are looking for a highly motivated top performer with deep technical skills in hardware design, and demonstrated technical leadership across disciplines (Hardware, Embedded Firmware and Software), who can innovate on simple and effective solutions.





    Qualifications
    Qualifications:

    Bachelor's (undergraduate) degree or Master's (graduate) degree or Ph.D. (post graduate) degree in Electrical Engineering, Physics, or equivalent.
    Have demonstrated aptitude for electrical/electronics design and fundamentals, have hands-on working style.
    Experience in electronic circuit / PCB design and testing involving two or more of the following topics : microprocessors and memory systems, high-speed digital circuits, logic design, bus standards (PCI, USB, IDE,..), sensors and signal conditioning, motor control, power supplies.
    Experience with industry standard schematic capture and simulation tools (Mentor, Cadence, SPICE,..)
    Experience in computer science/programming, specifically embedded firmware development is also desirable.
    Have worked on detail design and sub-system or system integration for at least two product development cycles in an R&D environment
    Be fluent in English
    Are creative and can logically simplify a complicated problem set
    Have excellent teamwork and communication skills
    Character Traits:

    Enjoy R&D work
    Enjoy customer touch, willingness to create new ideas that will increase customer satisfaction.
    Ability to effectively interact and communicate in a cross functional and global team.
    Balance theoretical and hands on experience. Strong capacity to create and analyze system models.
    Are system thinker, can think outside the envelope.
    Are meticulous and willing to take risks to pursue the program objectives.


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公司介绍:

中国惠普有限公司 打印成像与消费市场集团

总部位于美国加州Palo Alto的HP公司创建于1939年。当时,在一间狭窄的车库里,两位年轻的发明家比尔·休利特和戴维·帕卡德,怀着对未来技术发展的美好憧憬和发明创造的激情,开始了硅谷的创业之路。在经过了六十多年的发展过程后,HP公司现已成为全球领先的面向大中小型企业、研究机构和个人用户的技术解决方案提供商。

HP在全球拥有约14.5万名员工,分为四大集团:企业客户及公共事业集团、产品技术及专业服务集团、信息产品及商用渠道集团和打印成像及消费市场集团。服务能力遍及170多个国家和地区,在IT基础设施、全球服务、商用和家用计算以及打印和成像等诸多领域位居领导地位。在截止至2005年1月31日的过去四个财季中,HP的总收入达到了818亿美元。

1985年,HP公司正式进入中国市场,成立了中国第一家中美合资的高科技企业——中国惠普有限公司。中国惠普几乎伴随中国走过了整个改革开放的过程。成立伊始,中国惠普就积极参与中国信息化建设事业。经过近20年的发展, HP目前在中国拥有九大区域总部、28个办事处、37个支持服务中心、超过200个金牌服务网点、两家工厂、一个全球软件开发中心、一个信息产品开发中心、一个全球运营中心以及惠普商学院、惠普IT管理学院和惠普软件工程学院。

秉承其著名的“惠普之道”,中国惠普有限公司致力于以具有竞争力的价格,为中国用户提供科技领先的产品与服务,并带来最佳客户体验,最终与中国社会实现共同进步。

HP is a technology solutions provider to consumers, businesses and institutions globally. The company’s offerings span IT infrastructure, global services, business and home computing, and imaging and printing. For the four fiscal quarters ended Jan. 31, 2005, HP revenue totaled $81.8 billion. More information about HP (NYSE, Nasdaq: HPQ) is available at ww***om.[点击查看]

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