职位描述：
EMA-Electronic Module Assembly.
Ground rules/Background;We are venturing into more technically difficult electronic module assemblies,from traditional SMT like APT conditioner modules into chip and wire modules requiring non main stream die attach and wirebond methods.(Example-DPS type module using MEMS based sense elements using platinum metallization and thus non standard wire bonding with compliant die attach and gels for encapsulation.) We need someone with the technical horsepower to move with the technology, and hence since we don't know exactly where we will be in the future the ideal candidate needs to have a fundamental understanding of material systems.
Given these challenges;
EDUCATIONAL BACKGROUND-
First Choice, Material Science or Materials Engineer(Branch of Chemical Engineering).Second Choice Chemical Engineer,or Mechanical Engineer with a strong materials back ground. Last Choice,Electrical Engineer,but must have a strong process/materials background. In all cases BS is a minimum requirement, with an MS being desirable.
General Requirements-
Candidate needs to be a self starter that can operate with limited supervision. Candidate will need to be able to identify problems and process weaknesses,without being assigned to look for a particular weakness. Candidate needs to be a methodical problem solver that follows and organized and logical approach to problem solving.Ideal candidate needs to be a hands on type. (Works on his own car,and knows which end of a soldering iron to hold....ok just joking,but you get my point.) A fundamental knowledge of electronics is desired, but nothing much deeper than knowledge of ohms law, or knowledge of how a diode works, and some basic circuit element understanding (nothing very deep, but some basic knowledge.)
Candidate needs to be an excellent communicator, and be able to work well with others in at times in non familiar environments Needs to be able to document process improvements,and report back to/ work with design engineers from several sites around the world. Needs to be able to communicate with suppliers who may have limited language skills in candidate's native language.Reasonably good command of English language is required.
Specific Skills and Experience-
Knowledge of chip and wire assembly techniques, including all facets of bare die attach polymer-(epoxy or silicones)(rigid or compliant)), eutectic,and solder,wire bonding including aluminum wedge and gold ball bonding. Knowledge of micro joining techniques,including resistance welding.Knowledge of plating techniques used in electronics.Knowledge of SMT,reflow soldering techniques and all types of solder attach methods for packaged components.Working knowledge of Pb free soldering and issues.Experience with traditional laminate based PCB's as well as metalized ceramic substrates including thick and thin film technologies.Knowledge of encapsulation methods including epoxy and compliant gels.Knowledge of the packaging techniques for bulk micro-machined based MEMs devices a plus.Experience and knowledge of flipchip assembly methods a plus.Some knowledge of the various analytical techniques available to assess packaging including SEM and Auger,Acoustic Tomography and X-Ray to mention a few,as well as the various methods to assess product cleanliness. Knowledge of DOE techniques including Taguchi methods utilizing orthogonal array experimental methods.Working knowledge of statistics and statistical process control.Knowledge of the automotive quality system requirements is desirable but not a requirement.Working knowledge of the elements of an AIAG PPAP including Process Flows,PFMEA's and Process Control Plans is a plus. Knowledge of best practice DFM techniques for electronic assemblies is a requirement. General knowledge of manufacturing required.
|
