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Imaging & Printing Group | |
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120662 Student Internship/Thesis (Technical) |
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| 发布日期： |
2007-03-15 |
工作地点： |
上海市 |
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| 招聘人数： |
若干 |
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| 薪水范围： |
面议 |
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职位描述：
Job Description
The PhotoSmart Division of Hewlett-Packard, located in sunny San Diego California, is the #1 worldwide supplier of devices which provide color printing, scanning, copying, camera connect, and faxing functionality all in a single product for the home and home office. The Division is starting a new R&D team in Shanghai to develop Entry Level All-in-One and Photosmart Printers.
The candidate will be part of the mechanical engineering design team responsible for the development of high performance inkjet printer and All-in-One products. The candidate will be responsible for:
Assisting senior ME(s) to implement product architecture and design concepts that meet goals and objectives.
Helping to develop designs to fulfill requirements with sufficient margin for high volume production (across multiple tool sets).
Helping to release part designs for tooling. Ensure manufacturability of the parts by conducting DFM reviews with the tooling engineers and IPMO procurement engineers. Provide 3D and 2D documentation.
Contributing to the team owning customer specification testing and prove system performance. Execute system test plans. Address defects and finalize designs. Help to verify that work meets all performance and reliability goals.
Qualifications
Bachelor's (undergraduate) degree or Master's (graduate) degree or Ph.D. (post graduate) degree in Mechanical Engineering or Physics or equivalent.
Musts:
Proven ability to design complicated mechanical parts.
Good working knowledge in Mechanical design fundamentals, hands-on working style.
Good working knowledge in CAD tool, preferable with Solid Designer, Solid Works or ProE.
Strong problem solving skills.
Ability to conceptualize, implement and validate a system level design and solution.
Knowledge and/or experience in thermoplastic injection molding tool and part design.
Strong verbal and written communication and collaborating skill.
Fluent in English.
Desired:
Technical design work experience with printing technologies.
Have worked on detail design, sub-system or system integration in product development cycle(s).
Additional requirements:
Enjoy R&D work, excited about technology an has the desire to learn new things
Creative and can logically simplify a complicated problem set
System thinking, can think outside the envelop
Work independently
MINIMUM
Requires BS in Mechanical Engineering. Must have demonstrated aptitude for mechanical design and fundamentals. Must have demonstrated ability to verify performance through empirical testing as well as analytical models. Must have excellent interpersonal and communication skills and be computer literate with 2D and 3D CAD skills. An ability to identify, quantify, and resolve subsystem and system design problems involving multiple people is also required.
Additional requirements:
Prefered candidates must be able to make clear and effective presentations to inform and persuade peers and managers. Communicate well verbally, in writing and graphically.
Computer literacy - spreadsheet, word processing understanding of basic file structures, network and web navigation familiarity.
Establish goals and formulate plans to achieve them.
Good problem solving skills
Works independently and as part of a team
Excited about technology an has the desire to learn new things
DESIRED:
MSME Degree and/or relevant printer mechanism design experience.
Working knowledge of statistics and data acquisition h/w & s/w
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HP is a leading global provider of products, technologies, solutions and services to consumers and business. The company's offerings span IT infrastructure, personal computing and access devices, global services, and imaging and printing. Our $4 billion annual R&D investment fuels the invention of products, solutions and new technologies so we can better serve customers and enter new markets. We invent, engineer and deliver technology solutions that drive business value, create social value and improve the lives of our customers.
中国惠普有限公司成立于1985年，是中国第一家中美合资的高科技企业。在二十年的发展历程中，中国惠普始终保持业务的高速增长，是HP全球业务增长最为迅速的子公司之一。
中国惠普公司总部位于北京，目前已在国内设立了九大区域总部、37个支持服务中心、超过200个金牌服务网点、惠普商学院、惠普IT管理学院和惠普软件工程学院，目前，惠普在中国约有员工6000余人，中国惠普有限公司致力于以具有竞争力的价格，为中国用户提供科技领先的产品与服务，培养一流人才、提供最佳客户体验，并最终与中国共同成长。
中国惠普业务范围涵盖IT基础设施、全球服务、商用和家用计算以及打印和成像等领域，客户遍及电信、金融、政府、交通、运输、能源、航天、电子、制造和教育等各个行业。
从创立之日起，中国惠普便将“做优秀的企业公民”作为自己立身于中国的基础。中国惠普不仅在中国推广“世界e家”计划、支持教育事业，并积极捐助医疗、环保等公益事业。中国惠普是北京外资企业十大纳税大户，并连续多年被全国外商协会评为十佳合资企业。从2001年起，中国惠普已连续五年荣获“中国最受尊敬企业”称号。 |
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