- 工作地点：上海
- 职位：中国惠普有限公司实习
- 信息来源：同济就业网
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| 中国惠普有限公司 | |
| 2007-03-27 15:41:10.0 点击次数：【35】 | |
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ntern Mechanical Engineer Job Description The candidate will be part of the mechanical engineering design team responsible for the development of high performance inkjet printer and All-in-One products. The candidate will be responsible for: · Assisting senior ME(s) to implement product architecture and design concepts that meet goals and objectives. · Helping to develop designs to fulfill requirements with sufficient margin for high volume production (across multiple tool sets). · Helping to release part designs for tooling. Ensure manufacturability of the parts by conducting DFM reviews with the tooling engineers and IPMO procurement engineers. Provide 3D and 2D documentation. · Contributing to the team owning customer specification testing and prove system performance. Execute system test plans. Address defects and finalize designs. Help to verify that work meets all performance and reliability goals. Job Requirement · Have demonstrated aptitude for mechanical design and fundamentals, have hands-on working style. · Be very good at using Solid Designer (3D/2D) or a very quick learner · Have knowledge and/or experience in thermoplastic injection molding tool and part design · Have ability to conceptualize, implement and validate a system level design and solution · Have demonstrated ability to verify performance through empirical testing as well as analytical models. Strong problem solving skills · Have excellent teamwork and communication skills · Be fluent in English Character Traits: · Enjoy R&D work · Are creative and can logically simplify a complicated problem set · Are system thinker, can think outside the envelope · Are meticulous and willing to take risks to pursue low cost solutions · Have flexible communication style, can collaborate globally
122235 — Firmware Engineer Intern (
Business Environment The digital camera market is a highly competitive, growing product category that requires breakthrough levels of value and differentiation each year. HP is applying its 20+ years of imaging expertise to create and deploy inventions across the digital camera product line. HP works closely with world leading suppliers to develop and manufacture high value digital camera solutions. The overall goal is to delight customers with uniquely featured cameras that capture great pictures and deliver the best digital photography print/share/store experience with other HP solutions. Qualifications Job Description As an R&D firmware engineer, you’ll explore and define opportunities, investigate, design, develop, validate, and integrate products. This assignment will be to design and deliver firmware systems for HP’s digital camera product line. You will work with team members to investigate new technologies and implement solutions for them. You may architect new firmware solutions to expand our solutions set for multiple simultaneous camera developments. You’ll design and implement new firmware components for key aspects of the solution. You will test the solutions in the lab and work closely with the Quality Assurance team to verify the final product meets all specifications and performance criteria, debugging and resolving defects and performance issues necessary to ensure quality product delivery. You may work with the marketing team to define new products and features for future camera products. You may work directly with Asian ODM partners in the design, implementation and manufacture of the cameras. Minimum requirements: - Bachelor's degree or higher in Computer Science or the equivalent - Embedded Firmware development experience - Knowledge in the architecture and design of embedded firmware systems - Knowledge in firmware implementation for integrated ASICs and the resultant low level firmware that controls electronic systems - Enjoy and thrive on working closely with other team members, third party OEM and ODM suppliers to achieve results - Fluency in English and local language Desired: - Master candidate - Experience in the design, turn-on, debug, and delivery of printed circuit boards - Comfort and clear capability to work in both the firmware and electronics domain, bridging the two Intern Electrical Engineer Job Description Participate as a member of an R&D design team responsible for the concept generation, investigation, circuit design, prototyping, testing, PCA design, qualification and release to production of electronic systems. Designing, prototyping and implementing analog circuit designs, digital circuit designs and system electronics designs.Test and verify your solutions to meet all functionality, reliability, serviceability, customer, and regulatory requirements.Develop engineering specifications and component requirements.He/She will be able to understand and learn the Image Quality (IQ) concept and its attributes, how they are perceived by the costumer, how a printing system works and how the electronics system manage and controls its performance. Job Requirement l Have demonstrated aptitude for electrical/electronics design and fundamentals, have hands-on working style. l Have expertise in some or all of the following areas: ASICs, SIC/PAL/PLD, PC board schematic and layout, power system, or high level system design; I/O technologies, micro-processor, CAD tools/languages (Cadence, l Have ability to conceptualize, implement and validate a system level design and solution l Have demonstrated ability to verify performance through empirical testing as well as analytical models. Strong problem solving skills l Have excellent teamwork and communication skills l Be fluent in English Character Traits: l Enjoy R&D work l Are creative and can logically simplify a complicated problem set l Are system thinker, can think outside the envelop l Are meticulous and willing to take risks to pursue low cost solutions l Have flexible communication style, can collaborate globally |
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