招聘封装研发工程师职位

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[回复本文] 发信人: yohoo(yohoo), 信区: job
标  题: 封装研发工程师职位
发信站: 饮水思源 (2007年03月28日17:03:14 星期三)

代公司招聘，条件如下：
Candidate Responsibilities:
1)New microelectronics package design & project development;
2)new small outline package(SOT,SOD) development;

Candidate Profile
1)Bachlor in Mechanical Engineering/Electronics Engineering or relative.
2)More than two years working experience of microelectronics package design  i
n the field of microelectronics discrete device;
3)Be familiar with the  microelectronics package process;
4)Be familiar with the quality system, such as ISO9001/TSA16949;
5)Excell in AUTOCAD/Inventor/solidworks etc.
6)Be good at communication, teamwork and outgoing;

If  you are interested in our position, please send your CV to Y_Q_wang@liteon
-semi.com.
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