- 工作地点：上海
- 职位：上海新进半导体制造有限公司2008年校园招聘
- 信息来源：上海交通大学就业网
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1. Design Engineer /设计工程师
Responsibilities:
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Perform circuit design, analysis, verification and support to layout designers to meet product specifications and application requirements.
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Work with project leaders to complete the project accurately and timely and coordinate with other departments related to IC development.
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Participate in product evaluation work and continuously acquire advanced technical skills and design methodology.
Requirements:
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Master or above in Microelectronics-related fields with knowledge of IC design and semiconductor device physics.
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Teamwork spirit and good communication skills in both Chinese and English.
2. System Engineer /系统工程师
Responsibilities:
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Evaluate the engineering samples of new products based on the device level and the system level.
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Perform definition, promotion of new product.
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Prepare technical materials, demo prototypes, devices simulation model and total system solutions.
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Work with FAE to solve system application related issues in end customer side.
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Continuously improve individual technical capability and maintain a solid understanding of system application of end customers and competitors.
Requirements:
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Master or above in EE, Power Electronics preferred.
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Knowledge of circuit design tools, such as PCB layout (Cadence/OrCad), circuit simulation (Pspice, SIMPLIS, Saber), and mathematics analysis (Mathcad).
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Good command of both Chinese and English.
3. Device Engineer /器件工程师
Responsibilities:
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Response for establishment, characterization and validation of device modeling library, device structures and technology-related design rules/files.
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Provide technical support on design quality, ESD protection devices to design engineer and layout engineer.
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Continually acquire advanced knowledge on device physics and technology.
Requirements:
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Master or above in semiconductor physics.
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Knowledge of Semiconductor physics, device simulation, layout design.
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Good command of both Chinese and English.
4. Circle Design Engineer/电路设计工程师
Responsibilities:
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Perform circuit design, analysis, verification and support to layout designers to meet product specifications and application requirements.
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Work with project leaders to complete the project accurately and timely and coordinate with other departments related to analog IC development.
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Participate in product evaluation work and continuously acquire advanced technical skills and design methodology.
Requirements:
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BS or above in Microelectronics/Electronics fields.
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Teamwork spirit and good communication skills in both Chinese and English.
5. Product Engineer/产品工程师
Responsibility:
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Set up, implement and evaluate related Test plan issue.
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Arrange Reliability Test (Burn in/ Package Qual./ESD/Latch etc.)
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Characterization for the results of CP test and FT test.
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Related Cost down projects (Yield improvement /Molding compound/ Bound wire/ test time/Optimize test plan).
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Handle PDR/NCR on time.
Requirements of职位5/6/7/10:
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BS in Microelectronics/Electronics fields.
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Good command of English and PC operation, good communication skill and team player.
6. Test Engineer/测试工程师
Responsibility:
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Handle design release to full release process (Test plan review and Arrange Reliability Test (Burn in/ Package Qual./ESD/Latch etc. Characterization for the results of CP test and FT test.).
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Mass production project management:
a. Handle PDR/NCR on time.
b. Related Cost down projects (Yield improvement /Molding compound/ Bound wire/ test time/Optimize test plan).
7. Assembly Engineer/封装工程师
Responsibility:
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Work out ABS in time to meet the requirement of Design and Marketing Dept.
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Set up packing specification based on P/N to meet customer requirement.
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Perform special control to meet the special request from sales or customer.
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Conduct related experiments for cost down or yield improvement to reach company target.
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Build ECN internal and notice subcontractor to get them fully understanding.
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Source and assistant new suppliers to help them meet BCD’s requirement and get finial qualification.
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Communicate with vendor to get technical fully support.
8. Process Engineer/工艺工程师
职责:
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解决生产线上工艺问题，建立OCAP，确保顺利流片。
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建立新工艺，验证新材料，以满足产品开发，降低成本等方面的要求。
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改善工艺控制，用SPC和相关统计方法，提高工艺参数Cpk。
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协助相关部门，提高良率和产品品质，不断优化工艺，提高产能。
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验证新设备并释放生产。培训工艺技术员和生产作业人员。
要求:
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材料/物理/化学/微电子专业本科学历。
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具备较强的团队合作和相互沟通，分析和解决问题的能力。可接受轮班。
9. Equipment Engineer/设备工程师
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保证设备的正常运行，为工艺生产提供稳定的设备状态，24小时待命。
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有效的解决设备出现的各种故障，减少设备的停机时间。
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实施设备预知性维修，改善工作质量，保持设备的性能状态，提高设备的UPTIME。
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协助工艺人员，优化生产工艺，确保工艺的稳定性。
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培训PM人员，使其能正确熟练的进行设备PM工作，处理一般常见的设备故障。
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负责设备相关文件的拟定、修改。负责制定备件申购计划，跟踪备件状况。
要求:
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机械/电子等相关专业本科学历。
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具备较强的动手能力，团队合作能力。可接受轮班。
10. 目检工程师 (视力良好,1.0以上。)
职责:
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制定并维护成品硅片出厂目检标准。
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根据成品硅片出厂检验规范和目检标准指导目检技术员/操作工进行日常的成品硅片表观质量检验。
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对目检技术员/操作工难于判断的硅片进行复查。
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对于较大的涉及两个或两个以上工艺段的表面异常，与MODULE工程师一起进行分析。
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定期完成报废片统计及异常分析报告。
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定期完成缺陷密度模式的统计及异常分析报告。
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地址：上海市宜山路800号 上海新进半导体制造有限公司 人力资源部 邮编： 200233
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