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中国惠普有限公司上海分公司

(全职,发布于2007-12-12) 相关搜索
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单位名称中国惠普有限公司上海分公司所在地区上海市
组织机构码000000000经济类型【三资企业】外商独资注册资金(万元)0货币类型.
人事部门名称人事部通信地址上海延安东路222号外滩中心邮编200002
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招聘公告主题中国惠普有限公司上海分公司招聘招聘类别全职
宣讲会地点 宣讲起始时间 宣讲结束时间 
招聘内容

时间: 12月13日, 周四, 下午两点地点: 电信楼5-100号

笔试: 14:50 - 16:00 (电子专业相关知识)

(请同学携带简历)

 

后续面试安排将从12月17日开始

 

该部门工作地点: 浦东外高桥保税区

 

如有问题, 或投递电子简历, 请使用: IPMO.Recruiter-cn@

 

 

Electronics Designer (Campus Hiring)

 

Responsibilities:

Participate as a member of a R&D design team responsible for the printer electronics circuit design, prototyping, testing, PCB design, qualification and release for production, working with internal and external design partners in a multinational environment.

We are looking for a highly motivated top performer with technical skills in hardware design, demonstrated learning capability across different disciplines (Mechanical Design, Embedded Firmware, Software), and able to take the following responsibilities:

o Develop innovative solutions for electronic systems to achieve and exceed project specifications.

o Design, prototype and implement analog circuit designs (like print head control, power electronics, advanced sensors, motion control…), digital circuit design (High Speed Digital Design, Microprocessor-based systems, FPGAs…) and system electronics integration.

o Work with layout designers to generate cost effective and reliable PCB layouts.

o Test and verify your solutions to meet all functionality, reliability, serviceability, customer, and regulatory requirements.

o Debug and solve technically challenging issues as part of a multidisciplinary design team.

 

Qualification

Master’s degree or Doctor’s degree major in analog or digital electronic engineering graduate in 2008:

o Have demonstrated aptitude for electrical/electronics design and fundamentals, have hands-on working style.

o Have expertise in some or all of the following areas: ASICs, SIC/PAL/PLD, PCB schematic and layout, power system, or high level system design; I/O technologies, micro-processor, CAD tools/languages (Cadence, Mentor, SPICE, Synopsis, Verilog, VHDL), electrical signal analysis, thermo analysis, etc.

o Have ability to conceptualize, implement and validate a system level design and solution

o Have demonstrated ability to verify performance through empirical testing as well as analytical models. Strong problem solving skills

o Have excellent teamwork and communication skills

o Experience in programming: embedded firmware, script languages, C/C++ and object oriented concepts.

o Excellent English communication skills, verbal and written.

o Willing to travel globally for extended periods of training and working.

 

Character Traits:

 

o Enjoy working with high-caliber multinational R&D teams co-developing leading technology

o Enjoy customer touch, willingness to create new ideas that will increase customer satisfaction

o Ability to effectively interact and communicate in a cross functional and global team.

o Are system thinker, can think outside the envelope

o Are meticulous and willing to take risks to pursue the program objectives

o Positive, precise and proactive manner

 

详情见附件!

相关链接 简历投递Emailfei.wei@
招聘面向对象 发布日期2007.12.12


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