COMPANY:
ASM Pacific Technology Ltd. is the worlds largest assembly and packaging equipment supplier for the semiconductor industry. Listed in Hong Kong since 1989 (ASMPT), ASM Pacific Technology Ltd. is 54% owned by ASM International N.V., a NASDAQ listed supplier of wafer processing equipment. ASM Pacific Technology Ltd. with headquarters in Hong Kong has operations in Shenzhen, China, Singapore and Malaysia. We are a leading supplier of a full line of
assembly and packaging equipment and process solutions for the semiconductor, photonics and optoelectronics industries. Our financial strength and R&D resources allow us to provide customers with total solutions, process innovation, package development and factory automation. Further details can be found at ww***com[点击查看]
For details of company profile and its products, please visit our website: ww***com[点击查看]
Interested applicants should send their CV to Mr. Qu Gang at gou@ ,with indication to which position and post interested.
Position 1: Process Engineers (Working in Singapore)
Post A:
Job Responsibilities:
Conduct research studies and establish non-linear deformable characteristics on flimsy material.
Develop algorithms or mathematical models to emulate deformable behavior.
Job Requirements:
PhD or Master degree in engineering or equivalent
Research area falls within solid mechanics, applied mechanics or computational mechanics.
Candidates with strong mathematical and computer simulation background, familiar with non¬linear deformable mechanics and software programming will be an added advantage.
Post B:
Job Responsibilities:
Apply statistical methodologies in process optimization such as DOE, SPC, 8D and FMEA.
Responsible for identifying, analyzing, characterizing and improve process related performance for an assigned process module.
Performing material analysis and bonding interface characterization and improve the process module performance.
Job Requirements:
PhD, Master or Bachelor degree in material science, physic, microelectronic or related field
Strong problem solving skills
Experience in scanning electron microscopy, FIB and TEM utilization and application.
A good knowledge in micro-electronic, intermetallic compound, intermetallic creation and growth, and semiconductor physic will be an added advantage
Possess excellent analytical abilities, troubleshooting techniques and capable of performing process engineering tasks commensurate with experience.
Position 2: Mechanical Engineers (Working in Singapore)
Post A:
Job Responsibilities:
Perform mechanical design and sustaining on precision mechanism and precision motion subsystem of wire bonding equipment that require high precision and high speed motion control.
Conduct vibration study, CAE analysis and improvement on mechanical structures or on high dynamic motion mechanisms.
Job Requirements:
Master degree in Mechanical Engineering
Proficiency in SolidEdge, Autocad and CAE
Proficiency in Structural and Model analysis
Post B:
Job Responsibilities:
Design of materia l handling modules and systems in automatic machine
Design of high precision dynamic modules
Develop operating concepts in consideration of mechanics, electronic hardware and software required.
Job Requirements:
Master or Bachelor Degree in Mech Engineering
Able to use CAD software such as Solidworks, Autocad, Pro-E, etc
Familiar with mechanism design
Good understanding of kinematics and kinetics as well as strength of mat’l in design considerations.
Good understanding of high precision manufacturing processes
Post C:
Job Responsibilities:
develop ultrasonic welding tools like gold and aluminum wire bonding transducers, flip chip bonding transducers
develop ultrasonic vibrators for different applications, like micro-shaker, ultrasonic cleaning device
study and analyze ultrasonic bonding related process
Job Requirements:
PhD or Master Degree in Mechanical Engineering
Good personality, willing to learn, good communication skill, good attitude.
Engineering Background in ultrasonic preferred
Working experience preferred
Post D:
Job Responsibilities:
Conceptual and detail engineering design of high precision, electro-mechanical systems
Conduct structural Finite Element Analysis
Perform tolerance analysis of mechanical assembly for cost-effective manufacturing
Assemble and test engineering prototypes
Job Requirements:
Masters or PhD degree in Mechanical/Mechatronics Engineering
Experience with Solid Modeling software is essential.
Preference for candidates with electromagnetic design and analysis experience
Position 3: Computer Vision Engineers (Working in Singapore or Hong Kong)
Post A:
Job Responsibilities:
Conduct the technology research on Computer vis ion system
Develop the algorithm for object recognition, inspection technologies for tough working conditions, sub-pixel accuracy object alignment, 3D image reconstruction and measurement and color image analysis
Job Requirements:
PhD or Master degree in Computer Science / Electronics Engineering or relevant disciplines
Research experience in Computer Vision, Image Analysis, Image Processing, 3D Vision or related field
Proficient in C/C++ programming under Windows
Post B:
Job Responsibilities:
Conduct the development on vision product
Develop high end Vision Products for assembly automation,
Design the visual inspection for process monitoring, parts measurement and inspection for semiconductor industry
Job Requirements:
PhD or Master degree in Computer Science / Electronics Engineering or relevant disciplines
Research experience in Computer Vision, Image Analysis, Image Processing, 3D Vision or related field
Proficient in C/C++ programming under Windows
Position 4: Software Engineers (Working in Singapore or Hong Kong)
Post A:
Job Responsibilities:
•Software development for semiconductor packaging machines
Job Requirements:
Master or Bachelor Degree in Electronic/Electrical/Computer Science/Physic
2 years or more of working experience in Software Development.
Good knowledge of C and C++ programming
•Strong working knowledge of ONE or more of the following areas is essential
Programming on Microsoft Windows OS or Linux OS
Object Oriented Design and programming
System programming for Windows or Linux
Software Testing and Life Cycle Development
Software development on MS .Net or Web Applications
Good oral and writing skills.
Post B:
Job Responsibilities:
Develop software for automation and control applications
Develop advance algorithm to control the machines
• Provide technical support in the product development
Job Requirements:
Master or Bachelor in Electronic/Electrical/Computer Science/Physic
Good working knowledge in C/C++ as well as sound knowledge in OOP
Experience on control/automation software, system programming and software testing
Position 5: Hardware Engineers (Working in Singapore or Hong Kong)
Post A:
Job Responsibilities:
Design the electronic for machine automation with PC, micro-controller, DSP, FPGA, power electronics
Design the electronics for sensor technology and measurements;
Job Requirements:
Master or PhD degree in Electrical/Electronics Engineering;
Good knowledge in PC hardware, Various Motor control hardware, Power Electronics.
At least 2 years prior working experience, potential and attitude are important;
Position 6: Control Engineers (Working in Singapore)
Post A:
Job Responsibilities:
Conduct the analysis on servo/motion control system
Develop the advanced control algorithms for high dynamic and high precision servo/motion system
Design the servo/motion control for high precision machines
Diagnose on electromechanical system
Job Requirements:
Master or PhD degree in Automatic control, Computer Science, Mathematics, Mechanical or Electrical Electronics Engineering.
Knowledge/application experience on servo control and motion control for electromechanical system
Knowledge/application experience on robust control, inverse dynamics, and adaptive control will be especially welcome.
Position 7: CAE Engineers (Working in Singapore)
Post A:
Job Responsibilities:
•Perform solid mechanic CAE simulation / experimental verification on machinery mechanical structure, assembly and semiconductor packaging process
Job Requirements:
Master or PhD degree in Mechanical Engineering
solid hands on experience in linear and non-linear characterization of
mechanical structures in subsystem and system level for high precision
and high dynamic machines
solid hands on experience in subsystem and system level optimization.
familiar of using Ansys, Abacus, Marc to do simulation.
5-7 years of working experience.
Post B:
Job Responsibilities:
Perform CAE fluid simulation in semiconductor packaging process and machine design.
Job Requirements:
Master or PhD degree in Mechanical Engineering
solid hands on experience in Newtonian and non-Newtonian fluid dynamic characterization in dispensing, mold flow, liquid cleaning,…
familiar of using Fluent, Ansys/CFX to do simulation
5-7 years of working experience.
Interested applicants should send their CV to Mr. Qu Gang at gou@ ,with indication to which position and post interested.
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