Silicon Laboratories Introduction
Silicon Laboratories (NASDAQ: SLAB), is an industry leader in the innovation of
high-performance, analog-intensive, mixed-signal ICs. Developed by a world-class engineering team with unsurpassed expertise in mixed-signal design, Silicon Labs’ diverse portfolio of highly-integrated, easy-to-use solutions offers significant advantages in performance, size, cost and power consumption.
Headquartered in Austin, TX, Silicon Labs is a global enterprise with operations, sales and design activities worldwide. The company is committed to contributing to our customers’ success by recruiting the highest quality talent to create industry changing innovations.
Founded in 1996 on the principles of constant innovation and solid execution, Silicon Labs’ strong business fundamentals and proven track record have resulted in sustained growth throughout the companys history. Silicon Labs consistently introduces best-in-class products implemented in CMOS that dramatically improve the customer value proposition. These products vastly simplify the customer design process and speed time to market by leveraging cutting edge architectures and CMOS process technology.
Silicon Labs portfolio of both application specific and general purpose products includes
high-performance, mixed-signal microcontrollers,
broadcast audio solutions,
ISOmodem® embedded modems,
ProSLIC® subscriber line interface circuits,
silicon direct access arrangements (DAAs),
satellite set-top box receivers,
voice codecs,
VCXOs and XOs,
SiPHY® transceivers,
clock and data recovery ICs and
precision clock ICs. These patented solutions serve a broad set of markets and applications including consumer, communications, computing, industrial and automotive.
Silicon Labs is a fabless semiconductor company, enabling it to take advantage of widely available process technology that allows for reliable, mass production of the companys products at the worlds most prominent semiconductor foundries. Silicon Labs is an ISO-9001 Certified Manufacturer.
芯科科技(NASDAQ: SLAB)是一家业内领先的高效能模拟与混合信号IC设计厂商，公司由混合信号设计方面具有顶尖水准的世界一流研发团队开发的高整合度，容易使用的多元化产品线解决方案在性能、尺寸、成本及功耗方面具有卓越优势。
芯科科技总部位于美国德克萨斯州的奥斯汀市，是一家在全球范围内开展研发及销售的跨国企业。公司秉承聘用最拔尖人才不断地进行革命性创新的理念，为顾客的成功尽心尽力。
芯科科技成立于 1996 年，本着不断创新和稳健执行的原则，其坚实的业务基础和优良的业绩使公司自成立至今一直处于持续发展的状态。芯科科技始终如一地推出 CMOS 工艺上实现的最佳产品，显著地改进客户的价值提案。这些产品通过利用前沿的系统架构和 CMOS 加工技术，极大地简化客户设计流程和缩短产品上市时间。
芯科科技推出的各种具备自主专利的专用和通用产品组合适用于各种市场及应用，其中包括高性能混合信号微控制器，广播音频解决方案，嵌入式ISO拨号调制解调器，PROSLIC用户线接口电路，直接接入端口芯片，卫星机顶盒接收器，语言编解码芯片，高性能振荡器， SiPHY收发器，数据时钟恢复，和精准时钟芯片等。
芯科科技是一家已通过ISO-9001认证的无工厂模式半导体公司，这种模式使其能够充分利用多种可选工艺在世界上最著名的半导体代工厂可靠地，大规模生产公司的产品。
Job Title 1: Systems Design Engineering – Internship (6-12Months)
Summary: Systems design intern engineer for an embedded DSP firmware development focusing on wireless radio transceivers.
Essential Functions:
· Participate in design tasks such as evaluating systems architecture and micro-architecture.
· Develop detailed communications algorithms mappable to firmware or hardware domain.
· Follow proven methodologies and hands-on design relevant DSP firmware or FPGA to realize the algorithms.
· Carry out debugging tasks when necessary.
· Regularly communicate with other team members on design issues.
Qualifications:
Education and/or Experience:
An electrical engineering bachelors degree and is working toward a master’s or PhD’s degree with at least 1 year into the graduate program, past experience in digital signal processing design project for wireless communications is a plus.
Knowledge, Skills, and Abilities:
· Strong background and curiosity in fundamental digital communication and digital signal processing theory.
· Familiar with verilog/VHDL hardware description language and FPGA development.
· Familiar with matlab or C based algorithm modeling and C for software development.
· Basic grasp of assembly language programming and microprocessor and DSP architecture.
· Strong debugging skills
· Proficiency in MS Office
· Written and verbal communication skills.
NO. 01系统设计 实习生 （无线收发器数字信号DSP 韧件开发方向）
基本职能：
。参与设计开发如系统架构及宏模块评估；
。开发可影射到软，硬件的具体子模块；
。依照公司设计流程完成所设计的DSP韧件或FPGA；
。必要时进行调试和查错工作；
。与项目组其他成员保持交流沟通。
资格要求：
学历/经验：
有电子工程本科学位，至少修完一年课程的在读硕士或博士。有从事过无线通信DSP开发经验的更佳。
技能要求：
。在数字通信和数字信号处理方面有扎实的基础和浓厚的兴趣；
。熟练掌握Verilog/VHDL硬件描述语言并进行FPGA开发；
。熟练使用Matlab或C语言建模并使用C开发软件；
。基本掌握汇编和微处理器及DSP架构；
。很强的查错能力；
。熟练使用MS Office;
。较好的书写及口头表达能力。
Email: Judy.wu@ ; Song.chen@
Job Title 2: 软件设计工程师 Firmware Design Engineer (Full time)
Summary: Firmware design engineer for an embedded DSP and MCU firmware development focusing on wireless radio transceivers.
Essential Functions:
· Participate in design tasks such as evaluating systems architecture and micro-architecture.
· Follow proven design methodology and hands-on design relevant MCU or DSP firmware.
· Carry out debugging tasks in developing the fore-mentioned firmware design.
· Regularly communicate with other team members on design issues.
Qualifications:
Education and/or Experience: An electrical engineering bachelors degree and 2.5 years of experience, or master’s degree with 0.5 years of experience, including 0.5 or more in designing firmware systems for digital communications systems.
Knowledge, Skills, and Abilities:
· Basic understanding in fundamental digital communication and digital signal processing theory.
· Basic grasp of verilog/VHDL hardware description language.
· Solid skills with C for software development.
· Solid skills with assembly language programming and microprocessor and DSP architecture.
· Experience implementing software development tools for embedded systems
· Strong debugging skills
· Strong grasp of real-time embedded software design, development, and integration
· Basic software configuration management skills
· Basic understanding of software generation (compiler, linker, makefile, scripting languages such as Perl/tcl/shell etc.), experience with Linux environment is a plus.
· Proficiency in MS Office
· Familiar with lab debugging instruments such as oscilloscope and logic analyzers.
· Written and verbal communication skills.
· Ability to co-ordinate between local and remote design locations.
Email: Judy.wu@
Job Title 3 : IC Design Engineer (Full time)
Summary: Detailed design of analog/digital/mixed-signal circuits, including design capture, layout, test, evaluation and debugging of prototype ICs and design support for mass production.
Essential Functions:
Architects, designs and verifies circuits, logic, systems, algorithms, etc. to meet product requirements.
Determines design approaches and parameters.
Develops innovative new designs for patenting or protecting as trade secret.
Responsible for custom layout, including interaction with layout designers.
Conducts evaluation of design results by laboratory measurements of ICs.
Reports on design results through design reviews, in accordance with company quality requirements, and resolves action items generated as a result of these reviews.
Attends design reviews to provide input and learn from other designers’ experiences.
Researches design techniques through technical publications and seminars.
Supports marketing in product definition.
Supports efficient test program development.
Supports product engineering to meet manufacturing/production needs.
Supports applications engineering to meet customer needs.
Works under general supervision of project lead and/or senior project team members.
Interacts with internal and external personnel.
Developing professional expertise, applies company policies and procedures to resolve a variety of issues.
Works on problems of moderate scope where analysis of situations or data requires a review of a variety of factors. Exercises judgment within defined procedures and practices to determine appropriate action.
Normally receives general instructions on routine work, detailed instructions on new assignments.
Other duties as required.
Qualifications:
Experience and Education:
A technology-related bachelors degree or equivalent training and a minimum of 2 years of related experience. An advanced degree (Master or Ph.D) may reduce the minimum experience required.
Knowledge, Skills and Abilities:
Strong knowledge of engineering fundamentals
Knowledge of complex AC/DC analysis (poles, zeros, compensation)
Basic signal analysis knowledge (small-signal/linear, convolution, Fourier Transform)
Basic parasitic analysis knowledge (capacitance, resistance, power grid)
Basic MOS device modeling skills
Basic knowledge of CMOS fabrication processes
Basic knowledge of MOS transistors and analog/digital circuit design
Basic knowledge of digital design and design flows
Basic design skills in the following areas:
Schematic entry
RTL coding (digital designer)
System modeling (Matlab, C)
Firmware coding (digital designer)
Low-noise circuits
High-speed circuits
Building blocks (e.g., OPAMP, gm-C filters, switch capacitors, ADC, and DAC, state-machines, bus interfaces)
Phase detectors, ring oscillators, LC-VCOs, PLLs (analog designers)
DSPs, microcontrollers, memories (digital designers)
Verification skills (e.g., circuit simulation, logic simulation, static timing analysis, Matlab analysis)
Design implementation skills (e.g., custom layout, synthesis -> auto place and route flow)
Design for testability skills (e.g., controllability and observability through test modes, scan test, ATPG)
Proficiency in layout verification, DRC, LVS
Knowledge of scripting/language (perl, shell, tcl, skill)
Good laboratory measurement skills (analog and digital)
Knowledge of MS Office documentation, spreadsheet, presentation tools or equivalent tools
Familiarity with Quality systems and procedures
Excellent written and verbal communication skills
Ability to read and write technical literature and report in English
Email: Judy.wu@
