ASM成都研發中心

ASM Pacific Technology Ltd. is the world"s largest assembly and packaging equipment supplier for the semiconductor industry. Listed in Hong Kong since 1989 (fi***com[点击查看]), ASM Pacific Technology Ltd. is 54% owned by ASM International N.V., a NASDAQ listed supplier of wafer processing equipment(asmi). ASM Pacific Technology Ltd. with headquarters in Hong Kong has operations in Shenzhen, China, Singapore and Malaysia. We are a leading supplier of a full line of assembly and packaging equipment and process solutions for the semiconductor, photonics and optoelectronics industries. Our financial strength and R&D resources allow us to provide customers with total solutions, process innovation, package development and factory automation.

At moment, ASMPT has two R&D centers in Hong Kong and Singapore. As the steady growth of its business and the swift progress of semiconductor industries in Mainland China,  ASM decided to set up its third R&D center in China. Like other R&D centers of ASM, ASM Chengdu R&D center will mainly in the research and development on the core technologies related with semiconductor packaging equipment.

For details of company profile and its products, please visit our website: ww***com[点击查看]

Job title: Senior Electronic Engineer/Electronic Engineer

Work place: ASM Technology China in Chengdu.

Job Scope: Research and development on power laser application in semiconductor packaging equipment.

Job requirement:

1.  MSc, PhD in Physics, engineer physics and EE with thesis on optoelectronics and laser physics

2.  3-5 years experience in laser head design for high power diode-pumped Q-switch solid-state laser with UV (266 nm and 355 nm) output.

3.  Familiar with

-  stable laser cavity design by using software tool

-  various optical pumped geometry on gain medium such as Nd: YAG, Nd:YVO4 and Nd:YLF,

- use of non-linear crystal such as KTP for harmonic generation, frequency sum and frequency mixing, intra-cavity frequency doubling

- Q-switching and mode locking techniques and

- laser pulse compression technique.

4.  Experience in

- characterization of high power laser beam (both cw and pulse mode),

- measurement of M^2 and beam divergence angle.

- pulse duration of very short pulse

5.  Experience in the design of diode-pumped solid-state laser power supplies is a plus.