Coming soon! The IBM China IC Design Center 2009 campus recruitment
will kick-off after the National Day vacation!
IBM (China) Chip Design Center Engineers are working on cutting edge SoC
(System on a Chip), ASIC, Chipset, Digital Signal and Embedded Processor,
Silicon Analog/Digital/Mixed-Signal IP, and EDA tools and methodology
development for our clients inside and outside of IBM.
By employing the industry leading tools, methodology, and semiconductor
technologies ranging from 90nm to 45nm and beyond, you will be
participating in the delivery of end to end semiconductor solutions
including
-- architecture design and performance analysis/tuning,
-- frontend logic design and verification,
-- backend implementation and optimization,
-- analog/digital/mixed-signal circuit analysis and design,
-- EDA & methodology development,
-- foundry application support, as well as chip prototype and hardware
validation.
The application of the chips covers a wide range from Digital Media and
Consumer Electronics (DTV, STB, Gaming, Digital Camera, etc...),
Communication (wireless, highend Router, Switcher, etc...), Office
Automation (Highend Printer engine, etc), Automotive Electronics, and
High Performance Computing, etc...
请留意后继正式招聘通知！
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