ASM Technology China (先进科技（中国）有限公司) is the 3rd R&D Center of ASM Pacific Technology Ltd. in Cheng Du, China.
ASM Pacific Technology Ltd. is the world's largest assembly and packaging equipment supplier for the semiconductor industry. Listed in Hong Kong since 1988 (fi***com[点击查看]), ASM Pacific Technology Ltd. is 54% owned by ASM International N.V., a NASDAQ listed supplier of wafer processing equipment(asmi). ASM Pacific Technology Ltd. with headquarters in Hong Kong has operations in Shenzhen, China, Singapore and Malaysia. We are a leading supplier of a full line of assembly and packaging equipment and process solutions for the semiconductor, photonics and optoelectronics industries. Our financial strength and R&D resources allow us to provide customers with total solutions, process innovation, package development and factory automation.
At moment, ASMPT has two R&D centers in Hong Kong and Singapore. As the steady growth of its business and the swift progress of semiconductor industries in Mainland China, ASM decided to set up its third R&D center in China. Like other R&D centers of ASM, ASM Cheng Du R&D Center is mainly in the research and development on the core technologies related with semiconductor packaging equipment.
For details of company profile and its products, please visit our website: ww***com[点击查看]
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Interested applicants should send their CV both in English and Chinese to Mr. He Sheng at she@, with indication to the position interested |
Process Engineers
Job Responsibilities:
Ø Conduct research studies and establish the formable characteristics on flimsy material, or high viscosity fluid.
Ø Develop algorithms or mathematical models to emulate deformable behavior.
Ø Apply statistical methodologies in process optimization such as DOE, SPC, 8D and FMEA.
Ø Responsible for identifying, analyzing, characterizing and improve process related performance for an assigned process module.
Ø Performing material analysis and the interface characterization and improve the process module performance.
Job Requirements:
Ø PhD /Master degree in material science, chemistry , physic, microelectronic or related field with solid back ground and good knowledge in material fabrication, properties and characterization.
Ø Strong problem solving skills , Be able to use various process and analytic equipment
Ø Research area falls within solid mechanics, applied mechanics, computational mechanics or chemistry.
Ø Candidates with the knowledge in following area will be an added advantage
ü Strong mathematical and computer simulation background,
ü Familiar with non-linear deformable mechanics and software programming.
ü Experience in scanning electron microscopy, FIB and TEM utilization and application.
ü A good knowledge in micro-electronic, intermetallic compound, intermetallic creation and growth, and semiconductor physic
ü Possess excellent analytical abilities, troubleshooting techniques and capable of performing process engineering tasks commensurate with experience.
ü Knowledge and experience in electronic and opto-electronic packaging processes preferred
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