
此信息由前程无忧审核并发布(查看原发布网址),应届生求职网转载该信息只是出于传递更多就业招聘信息,促进大学生就业的目的。如您对此转载信息有疑义,请与原信息发布者前程无忧核实,并请同时联系本站处理该转载信息。
Responsibility:
1. Set up, implement and evaluate related Test plan issue.
2. Arrange Reliability Test (Burn in/ Package Qual./ESD/Latch etc.)
3. Characterization for the results of CP test and FT test.
4. Related Cost down projects (Yield improvement /Molding compound/ Bound wire/ test time/Optimize test plan).
5. Handle PDR/NCR on time.
Requirements:
1. Master in Microelectronics/Electronics fields.
2. Good command of English and PC operation, good communication skill and team player.