- 工作地点：上海
- 职位：Flip Chip Attach Engineer
- 信息来源：前程无忧
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Key Job Accountabilities
1. Support new package development or transfer through establishing processes, equipment / material.
2. Qualify new material and equipment to meet process requirement.
3. Establish process operating specifications/procedures, engineering change notice, etc.
4. Participate in factory operation procedure for new products or technologies;
5. Generate DOEs plan and perform experiments accordingly；
6. Qualify process, package & technologies thru evaluation or DOEs；
7. Write technical reports (DOE, Reliability Improvement, F/A, New material or product qualification)；
8. Keep good communication with customer on performance improvement and meet/exceed customer's requirement；
9. Perform any other duties as assigned by supervisor；
10. Patent infringement search and IP generation；
1. Support new package development or transfer through establishing processes, equipment / material.
2. Qualify new material and equipment to meet process requirement.
3. Establish process operating specifications/procedures, engineering change notice, etc.
4. Participate in factory operation procedure for new products or technologies;
5. Generate DOEs plan and perform experiments accordingly；
6. Qualify process, package & technologies thru evaluation or DOEs；
7. Write technical reports (DOE, Reliability Improvement, F/A, New material or product qualification)；
8. Keep good communication with customer on performance improvement and meet/exceed customer's requirement；
9. Perform any other duties as assigned by supervisor；
10. Patent infringement search and IP generation；
Required Experience and Qualifications
1. Bachelor Degree or above in Electrical/Mechanical/Material Science Engineering;
2. 3 years or more working experience in semiconductor IC assembly Flip Chip Attach (FAC) or Die Attach (DA) process will be preferred；
3. Familiar with Surface Mount Technology (SMT) process and SMT quality defects analysis will be preferred;
4. Good written / spoken English and reading comprehension；
5. 考虑优秀应届硕士毕业生。
1. Bachelor Degree or above in Electrical/Mechanical/Material Science Engineering;
2. 3 years or more working experience in semiconductor IC assembly Flip Chip Attach (FAC) or Die Attach (DA) process will be preferred；
3. Familiar with Surface Mount Technology (SMT) process and SMT quality defects analysis will be preferred;
4. Good written / spoken English and reading comprehension；
5. 考虑优秀应届硕士毕业生。
公司简要介绍：
星科金朋公司是世界排名前列的半导体封装测试公司，提供全球各地客户整体与快捷的高质量服务。客户群包括数家晶圆代工厂、全球知名IDM大厂与遍布全球各地集成电路设计公司。服务产品种类含盖通信、电脑、电源供应器与数据型消费性产品等。以先进制造与管理技术为基础，加上全球性布局，星科金朋在全球封装测试业树立了可靠与高质量服务的标竿。星科金朋公司在全球拥有一万多名员工，在新加坡、中国及中国台湾地区、韩国、马来西亚和美国等地设有工厂。
星科金朋（上海）有限公司位于上海西郊经济技术开发区，距虹桥机场仅8公里之遥，现有员工三千多人，占地面积11万平方米。公司提供定期和不定期的员工海外培训机会，为员工的发展提供广阔的平台。
公司将根据资历和相关工作经验对应聘成功者提供具有竞争力的薪金和福利，及相应的国内外培训机会。
凡有意应聘者请将详细的个人简历、学历证书、身份证及有关材料复印件邮寄、电子邮件或传真至本公司（请在信封/Email上注明应聘职位）。
如需获得本公司更多信息，请访问我们的网站。
星科金朋（上海）有限公司位于上海西郊经济技术开发区，距虹桥机场仅8公里之遥，现有员工三千多人，占地面积11万平方米。公司提供定期和不定期的员工海外培训机会，为员工的发展提供广阔的平台。
公司将根据资历和相关工作经验对应聘成功者提供具有竞争力的薪金和福利，及相应的国内外培训机会。
凡有意应聘者请将详细的个人简历、学历证书、身份证及有关材料复印件邮寄、电子邮件或传真至本公司（请在信封/Email上注明应聘职位）。
如需获得本公司更多信息，请访问我们的网站。
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