[北京]北京昆腾微电子有限公司2011校园招聘

北京昆腾微电子有限公司2011年校园招聘岗位

发布时间：2010-09-25    发布人：刘博联   浏览次数：24

工作地点 ：

 2011年校园招聘岗位

Company Name: KT Micro, Inc. （Beijing）
Company Profile：
KT Micro, Inc. is a fast-growing fabless semiconductor company headquartered in Southern California, USA. The company is specialized in high-end analog mixed-signal/RF IC design at both SoC and component level. By joining KT Micro, you will have chances to work on leading edge products with one of the most capable engineering teams in the world and grow together with the company.
As a strategic step, KT Micro is setting up a Beijing R&D Center to expand in response to expanding product lines. KT Micro is an equal employer and provides competitive compensation package as well as versatile career growth path specially tailored for each individual employee.

Position: Beijing based
Job Type: Full Time，2011 Master/Ph.D & Intern Student
Package: KT Micro provides competitive salary and benefit plans, as well as advanced career training programs.
Contact: 010-88891944/88891955
Email: zhangy@  baixue.gu@ 
Address: 北京市海淀区蓝靛厂东路2号金源时代商务中心2号楼B座8层B 《100097》

1. Analog/Mixed-Signal IC Design Engineer 模拟/混合信号芯片设计工程师
 Responsibilities:
 - Clear understanding of analog design concepts and knowledge. Modeling and system analysis skill using matlab/mathcad, etc.
 - Familiar with basic analog building block such as OPAMP, PLL, ADC/DAC, filter, reference circuit, etc
 - Good English communication skill
 - Self-motivated team player
2. RFIC Design Engineer集成电路射频芯片设计工程师
 Responsibilities:
 - Clear understanding of RF design concepts and knowledge. Modeling and system analysis skill using matlab/mathcad, etc.
 - Familiar with basic RF circuit building block such as OPAMP, LNA, mixer, PLL, PA, etc.
 - Good understanding of modern RF architectures, system partition is a plus
 - Good English communication skill
 - Self-motivated team player
3. Digital backend Engineer集成电路数字后端设计工程师
 Responsibilities:
 - Familiar with digital backend flow. Hands on experience on Synthesis, DFT, place & route, CTS, extraction, STA & physical Verification
 - Familiar with scripting languages
 - Good English communication skill
 - Self-motivated team player
4. 集成电路CAD工程师
 Responsibilities:
 - Provide CAD support to the IC design teams
 - Maintain CAD environment, PDK & design libraries
 - Work with EDA vendors to solve design flow or tool issues
 - Develop in-house tools & scripts
 - Create design flow documents & EDA training materials
 Requirements:
 - Familiar with IC design flow and related EDA tools (Synopsys, Cadence and Mentor, etc.) setup under Linux environment
 - Familiar with setup and maintain PDK and libraries
 - Familiar with IC design project directory set up and design database management
 - Experience in Perl, tcl/tk, C/C , Synopsys Scheme or Cadence SKILL language is a plus
 - Experience in Pcell development is a plus
 - good communication skill
 - B.S. Degree or above in Electrical Engineering or Computer Science. Major in Microelectronics is a plus.
5. Product Engineer 集成电路产品工程师
 Responsibilities:
 - Lead the efforts to understand root causes and execute on corrective actions for products not meeting expectations in performance, quality or reliability
 - Perform data and failure analysis for new process yield learning, production cost reduction and discrepant material disposition
 - Define and coordinate ESD/reliability tests
 - Engage and establish close business relationship with foundry, package and testing vendors
 - Negotiate with suppliers on pricing, delivery date and technical support
 Requirements:
 - Strong semiconductor device physics and processing background
 - Familiar with foundries and package houses in China
 - Good understanding on foundry processes, package forms & testing procedures
 - Knowledge of semiconductor defect/failure analysis, ESD, reliability testing, data analysis and statistics knowledge, wafer processing knowledge
 - Be able to work under stress in a fast-paced environment and travel frequently
 - Excellent command of both spoken and written English and Mandarin

6. Application Engineer 集成电路应用工程师
 Responsibilities:
 - Familiar with board level circuit components such as opamp, regulator, data converters, u-controller/processor, memory, etc.
 - Windows USB driver development and debug
 - 8051 firmware development
 Requirements:
 - Familiar with C/C programming
 - Sufficient English communication skill
 - Self-motivated & customer-oriented team player
7. System Engineer 集成电路系统设计工程师
 Responsibilities:
 -Applicant will work with a team of highly experienced analog / digital designers. 
 - Wll develop and improve of new algorithms and prototypes in audio digital signal processing. 
 -Part of the job is to support FPGA board prototype work.
 -candidates must have a strong background in several of the following topics:
   * applied mathematics (numerical optimization, non-linear approximations, statistics…)
      * signal processing
     * audio signal processing
     * acoustics
 Requirements:
    -Fluent in Matlab (object), C, C
    -Fluent English
    - Good communication skills
   - Audio digital signal processing intern ，It's basically DSP focusing on audio signal or 2011 Master Of Science / Engineering, preferably with advanced courses in audio processing.

备 注