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安湃软件科技(上海)有限公司

上海市浦东新区东方路899号1307-1310

 

 

About Apache Design Solutions

 

Apache Design Solutions is a leading Electronic Design Automation (EDA) software provider of
power and noise solutions for chip-package-system convergence from RTL to system sign-off.
Apache provides an eco-platform that integrates the SoC, custom IP, and package/PCB worlds.
From RTL power analysis and reduction, early stage prototyping and optimization, and through
chip and package sign-off, Apache’s products address the critical power noise challenges and
enable designers to reduce cost, mitigate risk, and improve time-to-market. Apache’s solutions
are adopted by top semiconductor and system design companies.

Founded in 2001 and headquartered in San Jose California, Apache Design Solutions is one of
the fastest growing, private companies in the EDA sector and currently has 5 engineering
centers worldwide (San Jose, Bangalore, Hsinchu, Shanghai and Chengdu). Apache has been
named as Deloitte LLP’s prestigious Technology Fast 500. recipients, one of the 500 fastest
growing technology, media, telecommunications, life science and clean technology companies in
North America For more information, visit
ww***com[点击查看].

 

 

 

 

 


 

Position 1 Sr. Software Developer – Circuit Simulation

 

Location: Shanghai, China

Send Resume to: jobs_shanghai@

 

Job Description

Develop and maintain the circuit simulation engine for IC-Package-PCB co-analysis

 

Qualifications

Strong knowledge of C/C programming skills

Experience with the algorithm and implementation of large data parsing, handling and processing

Experience with RLC, transmission line circuit or S-parameter simulations is required

Deep understanding of numerical integration, Newton-Raphson iteration and related knowledge is preferred

Good communication (written and verbal) skills in English

MS or PhD in Applied Mathematics, Physics, Electrical Engineering, Computer Science or related fields

 

Position 2 Software Developer

– Applied Mathematics / Numerical Computation

 

Location: Shanghai, China

Send Resume to: jobs_shanghai@

 

Job Description

Develop and maintain the numerical simulation module for IC-Package-PCB co-analysis

 

Qualifications

Strong C/C programming skills in Linux or Windows

Experience with the algorithm and implementation of large data parsing, handling and processing

Experience in numerical algebra, linear and non-linear optimization is required

Good communication (written and verbal) skills in English

M.S. Ph.D in Applied Math, Computer Science or other related areas

 

Position 3 Software Developer – SPICE Netlist Parsing

 

Location: Shanghai, China

Send Resume to: jobs_shanghai@

 

Job Description

Develop and maintain the SPICE netlist parser for IC-Package-PCB co-analysis

 

Qualifications

Strong knowledge of Lex&Yacc, C/C programming skills

Experience with the algorithm and implementation of large data parsing, handling and processing

Experience with SPICE simulation is a plus

Good communication (written and verbal) skills in English

BS, M.S. in Computer Science or other related areas


Position 4 Software Developer – IC Physical Design Database

 

Location: Shanghai, China

Send Resume to: jobs_shanghai@

 

Job Description

Develop and maintain the IC design database for IC-package-PCB power and signal integrity solution

 

Qualifications

Strong C/C programming experience in Linux

Experience with the algorithm and implementation of large data parsing, handling and processing

Experience with IC placement and routing including LEF/DEF/GDS data is required

Experience with SPICE simulation is a plus

Excellent verbal and written communication skills

M.S. or Ph.D. in Electrical Engineering, Computer Science or other related areas

 

Position 5 Software Developer – CAD Database Parsing

 

Location: Shanghai, China

Send Resume to: jobs_shanghai@

 

Job Description

 

Develop and maintain CAD database parsing module for IC-package-PCB power and signal integrity solution

 

Qualifications

Strong C/C programming experience in Linux or Windows

Experience with the implementation of complex geometry processing

Knowledge and experience of EDA database formats of package and PCB is preferred

Excellent verbal and written communication skills

BS, M.S. in Computer Science or other related areas

 

Position 6 Software Developer – GUI, Qt and OpenGL

 
Location: Shanghai, China

Send Resume to: jobs_shanghai@

 

Job Description

Design and implement the framework and Graphical User Interface for chip-package-PCB co-analysis solution

 

Qualifications

Strong skills in C /Object-Oriented-Programming, GUI (with Qt) and graphical programming (with OpenGL)

Five years of software development experience

Experience in large-scale software design

Good knowledge on data structure, software design pattern

Experience on visualization of large dataset such as graph plot development is a plus

Master’s degree in engineering, computer science

 


Position 7 Software Engineer – QA/Automated Testing

 

Location: Shanghai, China

Send Resume to: jobs_shanghai@

 

Job Description

Develop and maintain the automated QA testing system

 

 

Qualifications

1-2 years auto testing experience and/or test case scripts developing experience

Excellent implementation experience with software quality assurance for C/C development, build utilities,
and scripts

Experience in tcl/perl and LINUX shell script required

Experience in automatic testing for GUI is preferred

Excellent verbal and written communication skills in English

Bachelor degree or above

 

 

Position 8 Software Developer - Electromagnetic Solver

 

Location: Shanghai, China

Send Resume to: jobs_shanghai@

 

Job Description

 

Develop and maintain 3D electromagnetic modeling solutions for package and PCB power and signal integrity

 

Qualifications

 

Strong C/C programming experience in Linux or Windows

Solid background in numerical electromagnetic simulation solutions with FEM or MoM

Familiar with package and PCB modeling and related signal and power integrity issues

Self motivation, teamwork and strong English communication skills (both written and oral)

M.S. or Ph.D. in Applied Mathematics, Physics, Electrical Engineering, Computer Science or other related
areas

 

 

 

 




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