欢迎来到应届生求职网-中国领先的大学生求职网站

[西安|其它]SanDisk 2015校园招聘 宣讲会

(全职,发布于2014-10-21) 相关搜索
说明:

此信息由西安科技大学审核并发布(查看原发布网址),应届生求职网转载该信息只是出于传递更多就业招聘信息,促进大学生就业的目的。如您对此转载信息有疑义,请与原信息发布者西安科技大学核实,并请同时联系本站处理该转载信息。

SanDisk
信息提供: 学生就业指导中心   时间: 2014-10-21 21:12  

公司简介

SanDisk是全球最大的闪存存储解决方案提供商。我们的产品帮助您拍摄、分享、保存和欣赏精彩的数码世界。无论是相机中使用的移动存储卡、随身携带的智能手机,还是提供云计算服务的数据中心,SanDisk都可以通过随时随地的数据存储丰富人们的生活。

从1988年在美国硅谷创立,到1995年于纳斯达克上市,到2011年跻身美国财富500强,24年中SanDisk始终坚持创新,超越。目前SanDisk在全球拥有超过3000项专利。我们发明了大容量闪存存储卡,在 USB 驱动器领域走在最前列,并且开发了先进的闪存技术,为二十年时间里闪存成本降低50,000 倍做出了贡献。现在,我们的每单元存储三位数据 (X3) 技术、先进的架构和其它闪存创新技术正在支持着新型产品。

SanDisk在世界一流的制造厂中生产变革性的存储产品,每年闪存芯片的产量数以亿计。为了满足客户对闪存不断增加的需求,SanDisk于2005年开始在上海紫竹科技园设立全球唯一的封装测试工厂,在这里,我们利用经济高效的大产量制造和装配技术每天生产 200 多万个闪存产品。 我们与东芝公司合作运营着几处世界上最大、最先进的 NAND 闪存制造工厂,并且挑战性能极限,开发高效的新一代技术,如19 纳米(nm) 技术。

在SanDisk,我们崇尚“创新,超越,灵活,协作,诚信”的核心价值;在 SanDisk,我们相信企业社会责任(CSR)是企业整体成功的一个重要因素;在SanDisk,我们为员工提供有竞争力的薪酬待遇、快速的成长环境和广阔的发展空间。

欢迎加入SanDisk,加入闪存世界的No.1!

联系我们

公司地址:上海市闵行区江川东路388号

公司网址: ww***com[点击查看]

网申地址:http://campus.51job.com/sandisk

SanDisk招聘官方微博:@SanDisk人才招聘

投递简历请点: campus.51job.com/sandisk

招聘流程

地点

学校

时间

地址

西安

西安电子科技大学

10月25日周六 14:00-18:00

西安电子科技大学北校区离退休活动中心三楼

SanDisk开放日(第一场)

11月18日 9:00-17:00

上海市闵行区江川东路388号

SanDisk开放日(第二场)

11月20日 9:00-17:00

上海市闵行区江川东路388号

职位介绍

R&D

1. Test Development Engineer - (Java/C Programming)

Job Description:

1. In this position, the individual will assist in the debugging and development of NAND KGD, BI and MT test programs for automated test systems.

2. Full-automated test cell with tester and device handler, developing characterization and evaluation programs for new products and supporting failure analysis on test systems.

3. The individual will also be responsible for Java or C programming to debug software/ hardware in assembly and communicate clearly with various engineering departments.

Education/Experience Requirement:

1. Bachelor or Master Degree in Electronic, Automation, Computer Science or related major.

2. Strong Java or C programming skills, excellent debugging practices and the ability to write programs according to design documents and data sheets.

3. Proficiency in oscilloscopes, logic analyzers, and meters in the lab is a plus.

4. Ability to achieve results in a fast moving, dynamic environment.

5. Excellent English communication (written and verbal) and interpersonal skills

2. Product Engineer – (Memory Test)

Job Description:

1. Be responsible for packaged flash memory test program development, units failure analysis and device issue debug

2. Be responsible for NAND Product and Package Quality / Reliability tests setup / EFA / Action Plan.

3. Providing correct test condition for the memory product and generate defined test flow for volume testing needs

4. Product Evaluation DOE for Reliability / DPPM improvement and D/S and KGD Sort Yield improvement.

5. Run the test time analysis to get a lowest cost test method in order to reach short test time and high testing coverage

6. Define / improve testing method to deal with new product introduced to mass production and marketing

7. Deliver a world class throughput time on the testing code development to reach the most effective way of sample delivery TPT (Through Put Time)

8. Work with multinational team to complete assigned projects in PDT (product development team) required time.

Education/Experience Requirement:

1. Require Bachelor degree and above in Electronics Engineering, Automation, Microelectronics or related major.

2. Require familiarity with common lab equipment such as digital scope, logic analyzer, and multi-meter.

3. Require good written and verbal English.

4. Require good communication skills with other groups.

3. Product Engineer – (System Test)

Job Description:

1. Perform NAND memory (wafer-level/unit-level) design validation, characterization and qualification, using ATE tester.

2. Perform test program check-out and release to manufacturing.

3. Perform card-level product validation, characterization and qualification, using ATE tester.

4. Perform low yield analysis on issues related to circuit design, product defect, and manufacturing excursion.

5. Perform Electrical Failure Analysis on wafer-level/unit-level/card-level for Yield improvement, EDDPM reduction and test time reduction.

6. Prepare the validation/characterization/qualification report.

7. Monitor Key Product Indicators of manufacturing line. Help manufacturing engineers to solve technical issues.

Education/Experience Requirement:

1. Require Bachelor degree and above in Electronics Engineering, Automation, Microelectronics or related major.

2. Require familiarity with common lab equipment such as digital scope, logic analyzer, and multi-meter.

3. Require good written and verbal English.

4. Require good communication skills with other groups.

4. Test Development Engineer - (C /C Programming)

Job Description:

1. Design, develop, and implement Test System to test Company Flash Products, including OOP SW, Tester Interface, Device Drivers, Database, etc.

2. Involve in SW Development Life Cycle including Requirement Definition, System Design, Development, Integration and Testing.

3. Troubleshoot Test Solutions and New Products with Hardware, Product and Firmware Teams across sites. It involves understanding of device protocols, Software and Hardware debugging tool such as Multimeters, logic analyzers.

Education/Experience Requirement:

1. Bachelor degree in Computer Science/Electrical Engineering or equivalent

2. OOP concepts, Strong C/C programming skills, Scripting and Database knowledge is a plus

3. Experience with hardware debugging tools such as multi-meters and logical analyzers

4. Self-motivated and willing to learn

5. Excellent English communication (written and verbal) and interpersonal skills

5. Ability to troubleshoot and analyze complex problems.

6. Ability to multi-task and meet deadlines.

7. Excellent English communication (written and verbal) and interpersonal skills.

5. Reliability Engineer

Job Description:

1. This person will work in Reliability lab to perform Reliability Test on Production excursion evaluation or Package Qualification.

2. Need to study and set up the usage model for new package/product based on experiment data collection and analysis.

3. Need to work with packaging design team and process engineering team to define reliability test plan and sampling criteria.

4. Need to Maintain and develop the reliability test procedure, manage the rel test schedule and follow up the test result.

5. Need to work with FA Eng to perform 1st level validation and failure analysis for reliability test failures.

6. Understand the failure mode for process/package characterization.

Education/Experience Requirement:

1. Bachelor degree in Semiconductor / Material Science / Micro-electronics.

2. Willing to assume accountability. Willing to take challenge.

3. Good communicate skills. Good teamwork spirit. Quick learning ability.

4. Fluent English, reading and writing.

5. IC product technology. IC semiconductor assembly process.

6. Rel monitor process and sampling methodology.

7. IC life time requirement and acceleration factor methodology.

MFG

6. Product Engineer - (Wafer Test)

Job Description:

1. Provide production support engineering for specific product or group of products after transfer from development to high volume production.

2. Responsible for test program buy-offs and product qualification related to test.

3. Responsible for Failure Analysis for product yield improvement and meeting yield and quality target.

4. Sustain products with cost reduction and yield improvement.

5. Responsible to work with SDUS PE and Asia TE to drive test time reduction.

6. Implement and support daily activities on hold lot dispositions from low yield and QA reject

Interface with SDUS Product engineering, and various engineering teams in Asia to solve problems.

Education/Experience Requirement:

1. Bachelor degree in Electrical or Electronic Engineering or relevant above. Master or PhD preferred.

1. Good knowledge on CMOS and Electronic circuits.

2. Understand C/C language is a plus

3. Ability to achieve results in a fast moving, dynamic environment.

4. Ability to troubleshoot and analyze complex problems.

5. Ability to multi-task and meet deadlines.

6. Excellent English communication (written and verbal) and interpersonal skills.

扫描或添加xkdjyzx关注就业中心官方微信,及时获取招聘信息

关闭窗口

毕 业 了,找 工 作,上YingJieSheng.Com!


本站提醒:如何识别虚假招聘信息?求职必看,切勿受骗上当!

如何写一份简单、直接、高效的求职信?