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Location: Shanghai
Responsibilities:
Participates in a project teamof engineers involved in the specification, design, development and test ofhardware for HFC products.
Design hardware PCB boardincluding power supply, CPU, AD/DA, FPGA and etc.
Interfaces cross-functionallyat the working team level.
Work closely with SW designengineer, layout engineer, mechanical engineer and test engineer throughout thedevelopment process
Requirements:
Musthave skill/experiences
Familiar with CPU/Networkprocessor/CPLD/FPGA/ADC/DAC design
Familiar with ECAD tool, such as Protel, Cadence Concept/Allegro.
Familiar with serdes interface such as XFI, SFI and etc.
Experience in high speed circuit design and board level bring up
Knowledge in CPU system configuration and boot up
Fluent English speaking and writing
Good to have skill/experiences
Capability of proficiency with spice (orequivalent) circuit simulation
Networking knowledge such asTCP/IP, MAC and PHYlayers
General knowledge of modulation such as QAM and OFDM
knowledge for DOCSIS, HFC, PONor WiFi
Hands-on trouble shootingexperience
EducationalBackground
Typically requires MSEE/CS
Intern Period: > 6 months.