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职位描述:
1.新封装产品开发;
2.封装技术及工艺开发;
3.根据总部市场/运营部门的要求制定开发计划; 4.阅读设计图纸,潜在危险分析,树立实验(DOE)计划并进行试验,总结实验结果并提交报告;
任职要求:
1.半导体相关经验, 封装领域优先, W/B工程能力佳者优先。
2.机械工程/材料科学/物理/化学/电子/微电子等专业,本科及以上学历;
3.积极,独立,具有良好的沟通能力;
4.具有一定的抗压能力及限定时间内完成工作的能力;
5.流利的英语或韩语。
Responsibility:
1.New package product development
2.Package technology and Packaging Process Development.
3.Responsible for making development planning(schedule, material, equipment, investment etc),
4.Reviewing drawing, setting up DOE plan and performing DOE, summarizing DOE result and submitting DOE report.
5.Communicate with Samsung Korea and related departments of production plant to solve customer claims related with packaging process.
Requirements:
1.Persons in Seminconductor especially in assembly engineering background are preferred.
Goog skill in W/B process is highly appreciated.
2.BS, MS degree in Mechanical Engineering, Material Science, Physics, Chemistry,Electrical Engineering, Micro-electronics etc.
3.Initiative, independent and good communication skill.
4.Able to work under high pressure and time limitation.
5.Fluent English or Korean.