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Senior Engineer, Packaging Engineering
Responsibilities:
Process development on Advanced Die Attach, interact Technology, Material & Equipment;
Interface of process, to communicate the requirement from inner/outer customers;
Recipe Baseline & design rule maintain;
Trouble shooting for Advanced Die Attach process;
Program management for new/upgrade process;
New Package development, qualification, LVM till HVM, involve through process & technology.
Requirements:
Master Degree and above;
Major in Material science / Electric and Electronics/ Micro-electronics/ Semiconductor / Assembly engineering;
Skill of Static Analysis;
Good English communication (written and verbal) skills;
Able to do international travel occasionally;
Self-motivated, teamwork, hardworking, and be able to work under high pressure.