[上海]晟碟半导体（上海）有限公司

职能类别:高级硬件工程师

1. Senior Engineer, Packaging Engineering

Responsibilities:

PID Quality Control for new wafer technology:

Thin Die Qual design and validation;

PID Charz DOE design and validation;

PID process change related Charz DOE design and validation;

PID tape out involvement;

PID design with Lesson Learnt and FMEA;

PID PNTF, Statistic Design & Analysis, IVT, VECQ, ePPM Score card, Measurement Instruction, Validation, Toll Gate, etc.

New Technology Programs Design and Development Quality Assurance:

TDW/TDS/EDS/MDS, PNTF, CFMEA, VECQ, Measurement Instruction, Statistic Design & Analysis, Toll Gate, Audit, Validation, etc.

New PlatForms Design and Development Quality Assurance

Proposing, Verifying, Ground Rule, PNTF, PF-FMEA, VECQ, Measurement Instruction, Statistic Design & Analysis, Toll Gate, Audit, Validation, DI team, etc.

New Packages (retail) Design and Development Quality Assurance

PDS signature, Recipe Baseline, TDCN, IVT, Toll Gate, etc.

TDCN and DCCB review committee.

Excursion/Abnormal Control

RCA, Agile Team, DMAIC, etc.

Competitor Analysis for new Technology and PlatForm

Flip Chip, Fan In/Out, 3D NAND, High capacity PKG, etc.

Charz Analysis

FIB/SEM/EDX/3D X-ray/TEM/X-section/etc.

Requirements:

Master degree in Microelectronic science and technology or Material science and technology or Mechanical engineering or Electrical Engineering.

English communication skills: CET-6, be fluent both in oral and written English.

Basic understanding of assembly process flow & materials and wafer fabrication processes.

Basic knowledge of operation principle for NAND/DDR/ASIC.

Basic Computer & Microsoft Office skills are required, AutoCAD/Cadence/JMP are preferred.

Be capable of analyzing SEM/FIB/TEM/EDX results, operating is preferred.

Ability to achieve results in a fast moving, dynamic environment.

Ability to troubleshoot and analyze complex problems.

Ability to multi-task and meet deadlines with team work.

Open mind and positive communication with In-time feedback.

Good Adoptability and Agility with fast changing environment.

Self-motivated and self-directed, however, must have demonstrated ability to work well with people.

A proven desire to work as a team member, both on the same team and cross team.

Willingly creative and exceed.

Excellent English communication (written and verbal) and interpersonal skills.

Be capable of occasionally over time work and oversea business travel.

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