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岗位职责Job Responsibilities:
- 高可靠性印刷电路板组装技术和装配工艺的开发;
Development of highly reliable Electronic Assemblies and Processes for Printed Circuit Board Assemblies (PCBA);
- 对电子元器件及其组装过程中的新技术,新工艺以及新概念的 FE仿真和可靠性分析;
FE simulation and reliability analysis of new and improved technologies, processes and concepts regarding el. components and interconnects;
- 提供本地产品开发和全球项目的仿真支持;
Simulation support of local product development and global projects;
- 与博世的其它国际研发团队(德国,匈牙利,中国香港,印度),以及国内的研发机构展开合作。
Cooperation with international development locations (Germany, Hungary, Hongkong, India) and national institutes.
岗位要求Job Requirements:
- 计算工程,材料科学,机械工程,电气工程,物理以及相关学科的硕士及以上学历;
Study of Computational Engineering, Material Science, Mechanical Engineering, Electrical Engineering, Physics or comparable studies;
- 具有FE仿真经历(例如:ANSYS);
Experience in the field of FE Simulation (e.g. ANSYS);
- 对创新性,技术性问题和研发工作充满热情;
Enthusiasm for innovative, technical questions and academic work;
- 具有良好的工作习惯和优秀的品质;
Well-structured way of working and quality mind-set;
- 具有良好的沟通交流能力,能够领导跨学科团队;
Good communication skills and ability to lead interdisciplinary teams;
- 语言:中文,英语熟练。
Language skills: Chinese, Fluent English.