[苏州]安拓锐高新测试技术（苏州）有限公司

Our Engineering internship programme has been designed for penultimate year students. You will spend 12 weeks gaining hands-on experience within the Interconnect engineering department, contributing to our business and working on real projects. Typical placements could include 2D/3D drafting and design, electrical & mechanical design engineering, radio frequency design, digital software/firmware design, technology simulation & system analysis, material development, industrial engineering, project management and business development. In addition to your placement, 20% of your time will be working on a group business project, expanding your knowledge of Interconnect and Smiths and helping you develop your team work, time management and stakeholder engagement skills. We want you to get a real taste of some of the opportunities you will have if you join us. Our internships are fully assessed with successful candidates being offered a place on our full-time graduate programme where you'll spend two years working in our engineering group on 4x 6 month placements..

About you：

1.On target for minimum 2:1/ GPA 3.5 in an Engineering degree

2.Excellent science and maths academic background

3.In penultimate year of study

4.Strong interest in engineering as a career with ambitions to continually learn

5.Committed and able to work in a changing environment

6.Self-starter and self-sufficient - will hit the ground running

7.Strong desire to work across a global business

8.Innovative thinker and problem solving attributes

Apply for the program at  sm***com[点击查看]