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This job requisition is look for multiple candidates for the positions of Yield Engineer, FA Engineer, Defect Reduction Engineer, Integration Engineer, Device Engineer, Quality and Relibility Engineer, and Test Engineer, reporting to TD Integration or Device Engineering Managers. (Work location: Dalian, China) Examples of scope of work include silicon process improvement and product enhancement, device capability evaluation and expansion, and wafer cost reduction. Candidates must have demonstrated a track record of excellence in creative problem solving, device or test capability enabling, or manufacturing process optimization in a relevant engineering organization. Responsibilities include: - Perform feasibility study and provide integrated process solutions to meet desired device specification and process improvement requirements - Lead new device experimentation, implementation and high volume manufacturing readiness in the area of expertise - Define, explore and qualify new integrated process solutions to meet quality and output needs of new processes for high volume manufacturing ramp. Qualification - PhD in a science or engineering field and with graduation date in 2018 or early 2019 - Direct experience in semiconductor research/fabrication environment is highly desired - Demonstrated technical leadership and a track record of problem solving with creativity and out-of-box thinking - Strong expertise of process characterization, qualification and troubleshooting is required; Other Qualifications - Motivated self-starter, with strong ability to work independently as well as in a team environment; - Strong verbal and written communication skills in English; - Think and operate independently, while simultaneously focusing on many diverse priorities. - Flexibility and maturity in facing uncertainties and changing priorities/responsibilities - Commit to aggressive goals and win with a can-do attitude - Act with velocity and a strong sense of urgency - Respect cultural diversity and sensitivity - Agility in learning, improving, and innovating | |||