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PRINCIPLE DUTIES AND RESPONSIBILITIES 主要工作职责:
1.Follow netlist to do substrate lay out, optimize routing and provide substrate design with the best cost selection
依netlist提供最佳化的基板佈線設計與最具價格競爭優勢的基板設計
2.Generation Bonding diagram by assembly design rule
依封裝設計規則製作焊線圖
3.Package fitment drawing and die stackup feasibility
產品配置圖製作與晶片疊構可行性評估
4.Communication with assembly houses and substrate vendors for design review, design solution and drawing spec.
與封裝廠與基板供應商溝通尋找解決方案,針對基板設計進行設計審核與規格製訂
REQUIREMENTS职位要求:
1.Bachelor degree or above in science or engineering.
理工科系大學以上
2. Familiar with AutoCAD 2000 version or plus
熟悉AutoCAD 2000或以上
3. Strong communication skill
善於溝通協調與良好的溝通能力
5. Familiar with Cam350, Cadence SIP or Cadence APD is preferred
熟悉Cam350, Cadence SIP 或 Cadence APD優先
6. Nice to have PKG assembly or semiconductor knowledge
具封裝或半導體製程知識優先
7. Basic knowledge in substrate will be preferred
具封裝基板基本知識優先