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飞索半导体(中国)有限公司

(全职,发布于2007-09-21) 相关搜索
  • 工作地点:其它
  • 职位:2008校园招聘
  • 信息来源:西电就业网
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飞索半导体(中国)有限公司招聘信息
2007-9-21  


 
 
 
2007亚洲最佳雇主”(第1名)--飞索半导体(中国)有限公司
诚邀您的加盟!
 
飞索半导体是全球最大的专门提供闪存解决方案的高科技企业,为客户提供了最丰富、最全面的闪存产品线。飞索通过致力于为汽车、消费电子、网络和无线市场创建、保存和保护数字内容,从而,支持全球社会更加移动化、数字化和丰富多彩。公司在NASDAQ公开上市(代码[SPSN])。我们拥有世界领先的”MirrorBit” 技术。总部位于美国桑尼维尔,全球现有员工约9400人。我们在苏州设有最先进的封装和测试基地,并在苏州和北京设有设计中心,在北京、上海和深圳设有销售和营销机构。
 
飞索(中国)有限公司作为飞索半导体的独资子公司,位于苏州工业园区一期启动区内,是飞索的制造和研发中心,批准投资额为2.16亿美元,现有员工1300人。我们拥有世界上最先进的IC封装和测试设备,以及开发实验环境。其具有业界领先科技的MCP(多层芯片)技术已经实现6层芯片的封装,并且具备更轻薄、更微小的工艺和开发条件。
 
在科技领先的同时,飞索提供有竞争力的薪酬,并且积极为员工营造“快乐”的企业文化,倡导“工作着,快乐着”的大家庭氛围。依靠敬业的员工团队,飞索在翰威特亚洲最佳雇主的评选中,荣膺2007中国最佳雇主和亚洲最佳雇主榜首。
 
欢迎各位勇于面对挑战的菁英加盟,带上你的事业梦想和飞索一起腾飞!
 
 
飞索半导体公司在苏州成立设计中心简介
 
飞索是全球最大的专注于Nor型闪存解决方案的半导体公司。随着全球半导体产业持续向亚太地区转移,中国已成为世界上经济发展最快的国家,并且在可见的未来将继续保持这种增长。为了满足当前和未来中国及亚洲客户的需求,飞索战略性地在中国苏州设立了全球第六个研发中心。
 
该研发中心初期投资约520万美元,并计划未来三年内的总投资达2300万美元。到2010年设计研发人员将达50人。中心将充分利用飞索先进的深度微米半导体制工艺技术,围绕具有独立知识产权的MirrorBit或QuadBit NOR型大容量闪型存储器,重点开发和设计片上系统芯片,使闪存,微控制器,应用接口控制电路等模块无缝集成在单一硅晶片上,同时配合相应应用软件,给客户提供一套完整的芯片应用系统解决方案。
 
该中心的成立,旨在通过以客户需求为本,向客户提供成本效益最佳的系统解决方案,提高飞索产品在中国和亚太地区不断增长的市场中的竞争力。
 
校园招聘会宣讲时间:
 
2007年10月29日晚上       19:00-21:00
 
宣讲地点:
 
综合楼阶教112
 
招聘职位:
 
IC Design Center Positions:
1. IC Design Engineer
Requirements:
  • MS or PhD degree in Microelectronics/Computer Engineering/Digital Communication or related engineering field
  • Solid understanding of computer architecture, MCU (8051, ARM), digital logic, analog design basics and fundamentals of IC design flow
  • Excel in digital logic design, verilog/VHDL, and MCU related courses
  • Basic knowledge of flash or novitiate memory is desirable, but not manatory
  • Programming experience in C/C++, Assembly, and Perl, Tcl, Cshell or other shell scripting languages
  • Knowledge of Vera, SystemC or SystemVerilog is a big plus
  • School project experience in IC design/verification or validation in FPGA is a plus
  • Self-motivated, detail-oriented, a quick learner and a good team player
  • Verilog or VHDL RTL coding and synthesis
  • Exceptional Oral and Written communication skills
  • Fluent in both oral and written English
Responsibility:
  • Architectural and RTL design of complex, multi-million gate ASICs
  • Simulation and verification functional modules, synthesis, static timing analysis, and physical floorplanning
  • Additional responsibilities may include design validation on FPGA platform, and interface with engineers in analog, backend, firmware/software, system engineering teams and marketing teams…
 
2. IC Backend Engineer
Requirements:
  • Minimum BS degree in Microelectronics/Computer Engineering/Digital Communication or related engineering field
  • Understanding of computer architecture, MCU (8051, ARM), digital logic or analog design basics a plus
  • Understanding of fundamentals of IC design flow
  • Excel in digital logic design, verilog/VHDL, and MCU related courses
  • Basic knowledge of flash or novitiate memory is desirable, but not manatory
  • Programming experience in C/C++, Assembly, and Perl, Tcl, Cshell or other shell scripting languages a plus
  • Self-motivated, detail-oriented, a quick learner and a good team player
  • Strong written and verbal communication skills.
  • Exceptional Oral and Written communication skills
  • Fluent in both oral and written English a plus
 
Responsibility:
  • Floorplanning, gate placement, clock tree design and implementation
  • Power grid design and implementation, routing, physical verification (LVS/DRC)
  • On-chip signal integrity analysis (EM, IR drop, xtalk, antennas, etc.), and GDSII generation
  • Additional responsibilities include working closely with logic designers to enable physical synthesis based on the floor-planning
 
3. Application Engineer
Requirements:
  • Minimum Bachelor degree in Microelectronics, Computer Science/Engineering, Control Science/Engineering or related engineering fields.
  • Programming experience in C/C++, Assembly, and Perl, Tcl, Cshell or other shell scripting languages
  • Understanding of software engineering methodology
  • Knowledge of computer architecture (e.g. 8051, ARM), embedded systems and FPGA a big plus
  • Basic knowledge of flash or novitiate memory is desirable, but not mandatory
  • Embedded hardware design/development or debugging experience a big plus
  • Exceptional Oral and Written communication skills
  • Fluent in both oral and written English
 
Responsibility:
·       System application, middle ware and driver development on Linux/WinCE
·       Product specification, system verification/validation and support of key customers
·       Additional responsibilities may include failure analysis, and interface with IC design engineers
 
4. Firmware/Software Engineer
Requirements:
  • Minimum Bachelor degree in Microelectronics, Computer Science/Engineering, Control Science/Engineering or related engineering fields.
  • Programming experience in C/C++, Assembly, and Perl, Tcl, Cshell or other shell scripting languages
  • Understanding of software engineering methodology
  • Knowledge of computer architecture (e.g. 8051, ARM), embedded systems and FPGA a big plus
  • Basic knowledge of flash or novitiate memory is desirable, but not mandatory
  • Embedded hardware design/development or debugging experience a big plus
  • Exceptional Oral and Written communication skills
  • Fluent in both oral and written English
 
Responsibility:
·       System/software architecture design, product specification, hardware & software co-design
·       System & software development, verification, FPGA validation and system level test and release to production, and working very closely with IC design teams in New Production Introduction
·       Additional responsibilities may include customer support, failure analysis, and interface with IC design engineers, and marketing teams
 
 
 
Note
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原作者: 西安电子科技大学毕业生就业办公室
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