京睿科技（北京）有限公司
2008-12-11
基本信息
| 所在地区 | 北京市 | 单位地址 | 北京市海淀区中关村东路清华园1号院7号楼威盛大厦 | 隶属部门 | 北京市 |
| 联系部门 | 人力资源部 | 单位电话 | 联 系 人 | ||
| 单位性质 | 其他企业 | 单位传真 | |||
| 单位网址 | 电子邮件 | recruit-bj@ | 单位邮编 | 100084 | |
| 备 注 | |||||
需求信息
| 落实毕业生方式 | 个人自荐 | |||||||||||||||||||||||||||||||||||
| 提 供 待 遇 | ||||||||||||||||||||||||||||||||||||
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单位简介
京睿科技（北京）有限公司2009年校园招聘信息
公司简介：
VIA Telecom（公司网站：ww***com[点击查看]）是商用CDMA基带芯片以及成熟无线通信整体解决方案的提供商。我们高性能的单片CDMA基带处理芯片不仅支持cdma2000?技术，而且兼容IS-95A/B，可以在各类3G语音、数据和GPS设备上使用。除了开发强有力的芯片，VIA Telecom还提供辅助软件开发包，包括协议软件、完整的UI开发包和测试工具等。同时VIA Telecom为客户提供高质量、产品开发周期短的无线通信解决方案，包括运营商定制服务、完整的软件开发包以及全面的测试和生产技术支持。我们的整体解决方案，不仅缩短了产品的开发周期，而且也极大地降低了开发成本，加快了产品的上市速度。
VIA Telecom在全世界范围内设立了研发中心，包括美国加州的圣地亚哥(San Diego)和弗里蒙特(Fremont)、中国北京和杭州，并在美国、中国台湾、中国大陆以及韩国建立了销售网络。
VIA Telecom拥有强大的技术队伍，一流的仪器设备，完善的管理体系，蓬勃的市场前景。作为CDG、TIA、3GPP2及MIPI的成员和主要贡献者，VIA Telecom将会是未来无线通信领域的领导和创新者。
VIA Telecom是威盛电子的子公司，威盛电子有限公司（VIA Technologies, Inc. 简称 VIA）是无晶圆 IC 设计产业的先驱，也是核心逻辑芯片、低功耗 x86 处理器、先进的连接芯片、多媒体芯片和网络芯片以及完整平台解决方案的市场领导厂商。威盛电子的主要产品线包括跨平台系统芯片组，低功耗处理器平台，嵌入式系统以及图形处理器。
招聘职位：
Audio Engineer
Responsibilities:
1. Research and develop of audio algorithm such as speech enhancement, echo cancellation, noise cancellation;
2. Prepare the algorithm/design document.
Requirement:
1. Doctor degree;
2. Excellent understanding of Speech enhancement, Acoustic Echo Cancellation, Microphone array processing;
3. Excellent understanding of Adaptive signal processing;
4. Good understanding of the embedded system architecture, familiar with the embedded OS.
5. Good English communication skills, team work.
6. PhD in Electrical Engineering, Signal Processing, Computer Science or related major is required.
SoC Verification Engineers
Responsibility:
1. Verify mobile communication baseband IC which is compose of start-of-the-art SoC architecture incorporated with CDMA baseband technologies and cellular applications.
2. Develop testcases/testbench in Verilog, SystemVerilog, C, Perl and other languages.
3. Write detail test methodologies and plans, module-, subsystem-, and system-level testcases/testbenches, reference behavior models, achieve complete coverage to ensure first working silicon.
4. Debug and modify existing simulation models for SOC based ASICs.
5. Perform test coverage analysis using CAD tools.
6. Need to make and maintain developing schedule.
Requirement:
1. Master degree
2. Electrical Engineering or Design Automation (CAD) Engineering
3. Familiar with Verilog/VHDL, SystemVerilog, Perl and C languages at UNIX/Linux environment; the knowledge of SoC architecture is a must; familiar with AMBA bus is preferred and SoC verification experience is a plus.
4. Must be a team player and have demonstrated ability to work within and across teams located multiple sites
5. Excellent written and communication skills in both English and Chinese
3D graphics Engineer
Responsibility:
Research and Develop 3D Graphics engine for embedded system
Requirement:
1. Doctor degree;
2. Excellent algorithm background on 3D graphics area, such as computer graphics, image processing, 3D reconstruction;
3. Experience of OpenGL, OpenGL_ES, OpenVG, D3DM, GDI is preferred.
4. Good understanding of the embedded system architecture, familiar with the embedded OS.
5. Good English communication skills, team work.
6. PhD in Electrical Engineering, Signal Processing, Computer Science or related major is required.
公司地点：北京市海淀区中关村东路清华园1号院7号楼威盛大厦
有意者可将简历投递至：recruit-bj@（邮件主题请标明意向职位）
公司简介：
VIA Telecom（公司网站：ww***com[点击查看]）是商用CDMA基带芯片以及成熟无线通信整体解决方案的提供商。我们高性能的单片CDMA基带处理芯片不仅支持cdma2000?技术，而且兼容IS-95A/B，可以在各类3G语音、数据和GPS设备上使用。除了开发强有力的芯片，VIA Telecom还提供辅助软件开发包，包括协议软件、完整的UI开发包和测试工具等。同时VIA Telecom为客户提供高质量、产品开发周期短的无线通信解决方案，包括运营商定制服务、完整的软件开发包以及全面的测试和生产技术支持。我们的整体解决方案，不仅缩短了产品的开发周期，而且也极大地降低了开发成本，加快了产品的上市速度。
VIA Telecom在全世界范围内设立了研发中心，包括美国加州的圣地亚哥(San Diego)和弗里蒙特(Fremont)、中国北京和杭州，并在美国、中国台湾、中国大陆以及韩国建立了销售网络。
VIA Telecom拥有强大的技术队伍，一流的仪器设备，完善的管理体系，蓬勃的市场前景。作为CDG、TIA、3GPP2及MIPI的成员和主要贡献者，VIA Telecom将会是未来无线通信领域的领导和创新者。
VIA Telecom是威盛电子的子公司，威盛电子有限公司（VIA Technologies, Inc. 简称 VIA）是无晶圆 IC 设计产业的先驱，也是核心逻辑芯片、低功耗 x86 处理器、先进的连接芯片、多媒体芯片和网络芯片以及完整平台解决方案的市场领导厂商。威盛电子的主要产品线包括跨平台系统芯片组，低功耗处理器平台，嵌入式系统以及图形处理器。
招聘职位：
Audio Engineer
Responsibilities:
1. Research and develop of audio algorithm such as speech enhancement, echo cancellation, noise cancellation;
2. Prepare the algorithm/design document.
Requirement:
1. Doctor degree;
2. Excellent understanding of Speech enhancement, Acoustic Echo Cancellation, Microphone array processing;
3. Excellent understanding of Adaptive signal processing;
4. Good understanding of the embedded system architecture, familiar with the embedded OS.
5. Good English communication skills, team work.
6. PhD in Electrical Engineering, Signal Processing, Computer Science or related major is required.
SoC Verification Engineers
Responsibility:
1. Verify mobile communication baseband IC which is compose of start-of-the-art SoC architecture incorporated with CDMA baseband technologies and cellular applications.
2. Develop testcases/testbench in Verilog, SystemVerilog, C, Perl and other languages.
3. Write detail test methodologies and plans, module-, subsystem-, and system-level testcases/testbenches, reference behavior models, achieve complete coverage to ensure first working silicon.
4. Debug and modify existing simulation models for SOC based ASICs.
5. Perform test coverage analysis using CAD tools.
6. Need to make and maintain developing schedule.
Requirement:
1. Master degree
2. Electrical Engineering or Design Automation (CAD) Engineering
3. Familiar with Verilog/VHDL, SystemVerilog, Perl and C languages at UNIX/Linux environment; the knowledge of SoC architecture is a must; familiar with AMBA bus is preferred and SoC verification experience is a plus.
4. Must be a team player and have demonstrated ability to work within and across teams located multiple sites
5. Excellent written and communication skills in both English and Chinese
3D graphics Engineer
Responsibility:
Research and Develop 3D Graphics engine for embedded system
Requirement:
1. Doctor degree;
2. Excellent algorithm background on 3D graphics area, such as computer graphics, image processing, 3D reconstruction;
3. Experience of OpenGL, OpenGL_ES, OpenVG, D3DM, GDI is preferred.
4. Good understanding of the embedded system architecture, familiar with the embedded OS.
5. Good English communication skills, team work.
6. PhD in Electrical Engineering, Signal Processing, Computer Science or related major is required.
公司地点：北京市海淀区中关村东路清华园1号院7号楼威盛大厦
有意者可将简历投递至：recruit-bj@（邮件主题请标明意向职位）
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