晟碟半导体（上海）有限公司
【发布时间：2011-09-06】 【访问次数：4】 【关闭
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| 职位名称 | 封装工程师 Packaging Develop Engineer | ||
| 学历要求 | 博士,硕士 | 专业名称 | |
| 职位介绍 |
封装工程师 Packaging Develop Engineer
Requirement:
* Master degree or Ph.D degree.
* Good knowledge on Packaging engineering and popularly Science.
* Excellent English communication skills.
Responsibility:
* Develops new package requirements and maintains quality of existing packages for all product groups.
* Develops new package and process qualification programs.
* Performs package characterizations including cost effectiveness studies.
Email: staffing_NCG@
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| 招聘人数 | 5 | 工作地点 | 上海市 |
| 工资 | 面议 | 联系人 | 钱先生 |
| 固定电话 | 18801900491 | 手机 | 021-60905808 |
| E_mail | neo.qian@ | ||
【发布时间：2011-09-06】 【访问次数：4】 【关闭
】
