招聘简章/岗位要求：

以下岗位负责CFP2 100G 项目，有机会出国培训

Process Engineer 固晶焊线工艺工程师 (Die Attach/Wire Bonding)
Responsibilities:
1. Responsible for process ownership of the Die Attach (eutectic and epoxy DA) and Wire Bonding Process in the assembly line.
2. Develop the Die Attach/Wire bonding process for the new product.
3. Establish statistical process control (SPC) monitoring in Die Attach / Wire Bonding operation.
4. Improve yield & UPH of the assigned processes, including cost reduction activities.
5. Troubleshooting and problem solving in the assembly line using FMEA and statistical engineering tools related.
6. Performing DOE as necessary to make continuous improvements.
Process Engineer (Alignment) 光耦合工艺工程师
Main Responsibility:
1. Responsible for Optical Alignment Process in the production line;
2. Identify and implement process improvement alternatives to increase/optimize yield, efficiency and performance;
3. Develop an optical alignment process if necessary, perform Design of Experiments (DOE) and process validation, determine process capability (CPK), and define quality control plans;
4. Provide support to the production line for troubleshooting;
5. Perform other tasks assigned by the supervisor which arise.
Requirements:
1. Master’s degree or above, major in optical/ physics/optical electronics.
2. know C or C#