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Responsibilities:
- Participates in a project team of engineers involved inthe specification, design, development and test of hardware for HFC products. 
-Design hardware PCB board including power supply, CPU,AD/DA, FPGA and etc. 
-Interfaces cross-functionally at the working team level. 
- Work closely with SW design engineer, layout engineer,mechanical engineer and test engineer throughout the development process 
Requirements: 
Must have skill/experiences 
- Familiar with CPU/Network processor/CPLD/FPGA/ADC/DAC design 
-Familiar with ECAD tool, such as Protel, CadenceConcept/Allegro. 
- Familiar with serdes interface such as XFI, SFI and etc. 
- Experience in high speed circuit design and board levelbring up 
-Knowledge in CPU system configuration and boot up 
- Fluent English speaking and writing 
Good to have skill/experiences 
- Capability of proficiency with spice (or equivalent)circuit simulation 
-Networking knowledge such as TCP/IP, MAC and PHY layers 
- General knowledge of modulation such as QAM and OFDM 
- knowledge for DOCSIS, HFC, PON or WiFi 
- Hands-on trouble shooting experience
EducationalBackground 
-Typically requires MSEE/CS 
InternPeriod: > 6 months, 3 working days perweek.
Location:Shanghai