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[大连]英特尔半导体(大连)有限公司2018校园招聘

(全职,发布于2017-10-20) 相关搜索
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英特尔半导体(大连)有限公司- 校园招聘北京站
点击次数 12
发布时间:2017-10-20

宣讲会及面试安排:

 

宣讲会安排


时间:10月23日 14:00-16:00
地点:北京大学 化学学院A717会议室

时间:10月23日 18:30-20:30
地点:清华大学 职业发展中心 多功能厅–华为厅

 

欢迎国科大毕业生届时参加宣讲会!

面试安排

10月24日,地点另行通知

 

目标人群
2017/2018届博士毕业生
目标专业
理工科类(物理、化学化工、材料、光学、电气工程、电子信息等)
招聘需求
CET Process/ Integration/ Device Engineer(工艺/制程整合/器件研发工程师)- 职位介绍参考附件

简历递交方式

请发送个人简历至 dalianhr@,或现场递交简历,即日安排面试。

 

Job Summary

 

F68 Technology and Strategy Office (TSO) at Intel Dalian is forming a new engineering team with focus on manufacturing cost reduction through innovation, product enhancement, as well as developing and enabling equipment and process capabilities for future generations of 3D NAND technologies. 

 

This job requisition is look for multiple candidates for the positions of Process Engineer, reporting to Module Engineering Managers in TSO.  The selected candidates will be responsible for activities covering process, equipment, materials, and operations in their respective areas of expertise, such as CVD/PVD/CMP/Diffusion/Implant/Metro/Lithography/Wet Etch/Dry Etch.

 

Examples of scope of work include silicon process improvement and product enhancement, equipment capability evaluation and expansion, and wafer cost reduction. 

Candidates must have demonstrated a track record of excellence in creative problem solving, equipment capability enabling, or manufacturing process optimization in a relevant engineering organization.

 

Responsibilities include:

•      Perform feasibility study and provide module level process solutions to meet desired device specification and process improvement requirements

•      Lead new process experimentation, implementation and high volume manufacturing readiness in the area of expertise

•      Define, select and qualify the equipment platforms to meet quality and output needs of new processes for high volume manufacturing ramp.

 

 

Technical Qualifications

--BS, MS, or PhD in a science or engineering field and minimum 10 years of experience in semiconductor research, development or manufacturing environment are required;

--Demonstrated technical leadership and a track record of problem solving with creativity and out-of-box thinking

--Hands-on experiences in technology development, technology transfer or startup are required

--Strong expertise of process characterization, qualification and troubleshooting is required;

--Direct experience in Silicon Process Technology Development is highly desired.

Other Qualifications

--Motivated self-starter, with strong ability to work independently as well as in a team environment;

--Strong verbal and written communication skills in English;

--Think and operate independently, while simultaneously focusing on many diverse priorities.

--Flexibility and maturity in facing uncertainties and changing priorities/responsibilities

--Commit to aggressive goals and win with a can-do attitude

--Act with velocity and a strong sense of urgency

--Respect cultural diversity and sensitivity

--Agility in learning, improving, and innovating