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Responsibilities:
- Work with Design, Device, Test, Application, Process and QA Engineers, to evaluated new product and new Wafer Fab and Assembly process
- Perform and coordinate Reliability and Electrical test and Failure verification and Failure Analysis on the products
- Develop, evaluate, and improve manufacturing methods, utilizing knowledge of product design, materials and parts, fabrication processes, tooling and production capabilities, assembly methods and quality control standards. Work flexible hours as required to meet project deadlines and manage department
- Specification Configuration and management
- Administrative product management (iDDCM, Tandem…)
- Build and maintain traceability matrix
- Participate in DFMEA
- Manage characterization and qualification plan definition
- Evaluate test coverage
- Drive product characterization: collect and analyze data from lab and final test
- Perform product qualification: reliability tests, ESD, Latch-up, etc…
- Set up production tools in final test (burn-in, ATE, dash boards…)
- Prepare CAB sessions and PPAP documents
- Manage yield improvement, zero defect plans (PAT, SBL, JVT…) and Production ramp up and sustaining
- CQI investigations (ATE test, lab analysis and FA lab follow up)
- Use problem solving tools: 8D, FTA
Requirements:
- Bachelor degree or above with EE (Master is preferred), Communication or Automation related major
- Good skill at C/C++ or any other code experience is preferred
- Excellent communication and interpersonal skills in both English (CET-6) and Mandarin require to liaise with US and Europe.
- Experience/Education in Project Management will be an advantage
- Work experience in testing/application fields in Semiconductor industry is preferred (*)
- Willing to learn, take on challenges and self-motivated