
此信息由前程无忧(51JOB)审核并发布(查看原发布网址),应届生求职网转载该信息只是出于传递更多就业招聘信息,促进大学生就业的目的。如您对此转载信息有疑义,请与原信息发布者前程无忧(51JOB)核实,并请同时联系本站处理该转载信息。
1. Senior Engineer, Packaging Engineering
Responsibilities:
Develops packaging assembly process for new product, and introduces new product into production.
Defines new product’s package & assembly process requirements to meet product and customer
Requirements:
Characterizes package material, tool and process and coordinate qualification programs for product quality/cost/productivity effectiveness.
Prepares and/or updates specifications for piece parts of integrated circuits or semiconductor assemblies
Acts as a liaison with vendors.
Requirements:
Master or PhD Degree with Major in Mechanical Engineering, Material Science, Polymer Science, or Electrical Engineering;
Good to have internship experience or knowledge on semiconductor packaging;
Good to have a strong interest in electronic gadgets;
Excellent English communication (written and verbal) and interpersonal skills;
Hard working, and be able to work under high pressure