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Requirements:
1.Education: Master or above
2.Subject: Physics, Optical Communications, Material Engineering, Semi-conductor
3.CET4, Good communication skills both in English and Chinese;
Responsibilities:
1 Response to OSA spec and requirement from internal/external customer;
2 Define and release product test spec and spec on sub-assemblies and components.
3 Build and release product BOM structure
4 Generate process and test flow chart, and release the PMP document, and setup MES system
5 Drive yield improvement activities, generate yield report, failure modes analysis, coordinate supporting divisions reach yield target.
6 Generate and maintain cost model in perspectives of components cost, HPU, predict cost roadmap
7 Coordinate reliability test, lead cost reduction activities
8 Lead Design for Manufacturing (DFM) review, working with design engineers to generate MVT report.
9 Create debug tree. Debug MVT failed samples to identify design, assembly or test related issues. Feedback design/assembly/test related issues and resolving with respective teams.
10 Interface with sales and PLM teams to analyze customer technical spec and ensure accurate product customization. Generate customer sample test report.